SCASE09
June 2024
SN74ACT138-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics
5.7
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Balanced CMOS Push-Pull Outputs
7.3.2
TTL-Compatible CMOS Inputs
7.3.3
Wettable Flanks
7.3.4
Clamp Diode Structure
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.1.1
Power Considerations
8.2.1.2
Input Considerations
8.2.1.3
Output Considerations
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
8.4.1
Layout Guidelines
Bypass capacitor placement
Place near the positive supply terminal of the device
Provide an electrically short ground return path
Use wide traces to minimize impedance
Keep the device, capacitors, and traces on the same side of the board whenever possible
Signal trace geometry
8mil to 12mil trace width
Lengths less than 12cm to minimize transmission line effects
Avoid 90° corners for signal traces
Use an unbroken ground plane below signal traces
Flood fill areas around signal traces
For traces longer than 12cm
Use impedance controlled traces
Source-terminate using a series damping resistor near the output
Avoid branches; buffer signals that must branch separately