SCDS277B November   2008  – July 2024 TS3USB221A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Dynamic Electrical Characteristics, VCC = 3.3V ±10%
    7. 5.7  Dynamic Electrical Characteristics, VCC = 2.5V ±10%
    8. 5.8  Switching Characteristics, VCC = 3.3V ±10%
    9. 5.9  Switching Characteristics, VCC = 2.5V ±10%
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Power Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision A (February 2015) to Revision B (July 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the ESD performance test conditions in the Features sectionGo
  • Changed CDM test conditions in the ESD Ratings table from: per JEDEC specification JESD22-C101 to: per ANSI/ESDA/JEDEC JS-002Go
  • Added footnote to the VI/O parameter in the Recommended Operating Conditions tableGo
  • Changed RSE (UQFN) junction-to-ambient thermal resistance value from: 179.7°C/W to: 204.8°C/WGo
  • Changed RSE (UQFN) junction-to-case (top) thermal resistance value from: 107.9°C/W to: 118.1°C/WGo
  • Changed RSE (UQFN) junction-to-board thermal resistance value from: 100.7°C/W to: 121.5°C/WGo
  • Changed RSE (UQFN) junction-to-top characterization parameter value from: 7.1°C/W to: 13.9°C/WGo
  • Changed RSE (UQFN) junction-to-board characterization parameter value from: 100.0°C/W to: 121.2°C/WGo
  • Changed the VIK value in the Electrical Characteristics table from: –1.8V maximum to: –1.8V minimumGo
  • Changed the Typical Characteristics sectionGo

Changes from Revision * (November 2008) to Revision A (February 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Deleted the Ordering Information table from the data sheet. See the Mechanical, Packaging, and Orderable Information section for the ordering informationGo
  • Update the document to the new TI data sheet standard Go