SCDS394B march   2021  – june 2023 TMUX7462F

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics (Global)
    6. 6.6  ±15 V Dual Supply: Electrical Characteristics
    7. 6.7  ±20 V Dual Supply: Electrical Characteristics
    8. 6.8  12 V Single Supply: Electrical Characteristics
    9. 6.9  36 V Single Supply: Electrical Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  On-Leakage Current
    3. 7.3  Input and Output Leakage Current under Overvoltage Fault
    4. 7.4  Fault Response Time
    5. 7.5  Fault Recovery Time
    6. 7.6  Fault Flag Response Time
    7. 7.7  Fault Flag Recovery Time
    8. 7.8  Fault Drain Enable Time
    9. 7.9  Inter-Channel Crosstalk
    10. 7.10 Bandwidth
    11. 7.11 THD + Noise
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat ON-Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Input Voltage Tolerance
        2. 8.3.2.2 Powered-Off Protection
        3. 8.3.2.3 Fail-Safe Logic
        4. 8.3.2.4 Overvoltage Protection and Detection
        5. 8.3.2.5 Latch-Up Immunity
        6. 8.3.2.6 EMC Protection
      3. 8.3.3 Overvoltage Fault Flags
      4. 8.3.4 Bidirectional Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Fault Mode
      3. 8.4.3 Truth Table
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD to VSS Supply voltage 48 V
VDD to GND –0.3 48 V
VSS to GND –48 0.3 V
VFP to GND Fault clamping voltage –0.3 VDD + 0.3 V
VFN to GND VSS – 0.3 0.3 V
VS to GND Source input pin (Sx) voltage to GND –65 65 V
VS to VDD Source input pin (Sx) voltage to VDD or VD –90 V
VS to VSS Source input pin (Sx) voltage to VSS or VD 90 V
VD Drain pin (Dx) voltage VFN–0.7 VFP+0.7 V
VDR Logic input pin (DR) voltage(2) GND –0.7 48 V
VFF Logic output pin (FF) voltage(2) GND –0.7 6 V
IDR Logic input pin (DR) current(2) –30 30 mA
IFF Logic output pin (FF) current(2) –10 10 mA
IS or ID (CONT) Source or drain continuous current (Sx or Dx) IDC ± 10 %(3) IDC ± 10 %(3) mA
Tstg Storage temperature –65 150 °C
TA Ambient temperature –55 150 °C
TJ Junction temperature 150 °C
Ptot(4) Total power dissipation (QFN) 1600 mW
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Stresses have to be kept at or below both voltage and current ratings at all time.
(3) Refer to Recommended Operating Conditions for IDC ratings.
(4) For QFN package: Ptot derates linearly above TA = 70°C by 23.5 mW/°C