SCDS464B June   2023  – July 2024 TMUX2889

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Source or Drain Continuous Current
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  On-Leakage Current
    3. 6.3  Off-Leakage Current
    4. 6.4  Power-Off Leakage Current
    5. 6.5  tON (VDD) and tOFF (VDD) Time
    6. 6.6  Transition Time
    7. 6.7  Break-Before-Make
    8. 6.8  Propagation Delay
    9. 6.9  THD + Noise
    10. 6.10 Power Supply Rejection Ratio (PSRR)
    11. 6.11 Charge Injection
    12. 6.12 Bandwidth
    13. 6.13 Off Isolation
    14. 6.14 Crosstalk
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Truth Table
    3. 7.3 Feature Description
      1. 7.3.1 Beyond the Supply
      2. 7.3.2 Bidirectional Operation
      3. 7.3.3 Over Temperature Protection
      4. 7.3.4 Power-off Protection
      5. 7.3.5 1.8 V Logic Compatible Inputs
      6. 7.3.6 Fail-Safe Logic
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Audio Input or Output Switching
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

5.7 Switching Characteristics

VDD = 3.3 V, GND = 0 V (unless otherwise noted) 
Typical at VDD = 3.3 V, TA = 25℃  (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
tTRAN Transition time from control input VS = 3.3 V
RL = 50 Ω, CL = 35 pF		 25°C 10 340 us
–40°C to +85°C 490 us
–40°C to +125°C 490 us
tBBM Break-before-make time delay VDD = 1.8 V to 2.5 V
VS = 3.3 V
RL = 50 Ω, CL = 35 pF		 25°C 40 420 us
–40°C to +85°C 40 490 us
–40°C to +125°C 40 490 us
tON (VDD) Device turn on time
(VDD to output)		 VDD rise time = 1 µs
RL = 50 Ω, CL = 35 pF		 25°C 175 us
QINJ Charge injection VS = 0 V, CL = 100 pF  25°C 5 pC
OISO Off-isolation RL = 50 Ω , CL = 5 pF
VS = 200 mVRMS, VBIAS=0 V, f = 100 kHz		 25°C –55 dB
XTALK Crosstalk RL = 50 Ω , CL = 5 pF
VS = 200 mVRMS, VBIAS=0 V, f = 100 kHz		 25°C –100 dB
BW –3dB Bandwidth RL = 50 Ω , CL = 5 pF
VS = 200 mVRMS, VBIAS=0 V		 25°C 72 MHz
IL Insertion loss RL = 50 Ω , CL = 5 pF
VS = 200 mVRMS, VBIAS=0 V, f = 1 MHz		 25°C -0.01 dB
ACPSRR AC Power Supply Rejection Ratio VPP = 0.62 V on VDD
RL = 32 Ω , CL = 5 pF,
f = 20 kHz		 25°C –80 dB
THD+N Total Harmonic Distortion + Noise VPP = 0.5 V, VBIAS = 0 V
RL  =  600 Ω
f = 20 Hz to 20 kHz		 25°C 0.0006 %
–40°C to +85°C 0.001 %
–40°C to +125°C 0.001 %
25°C -105 dB
–40°C to +85°C -100 dB
–40°C to +125°C -100 dB
VPP = 0.5 V, VBIAS = 0 V
RL  =  32 Ω
f = 20 Hz to 20 kHz		 25°C 0.0008 %
–40°C to +85°C 0.001 %
–40°C to +125°C 0.001 %
25°C -102 dB
–40°C to +85°C -100 dB
–40°C to +125°C -100 dB
CS(OFF) Source off capacitance VS = 0 V, f = 1 MHz 25°C 70 pF
CS(ON),
CD(ON)		 On capacitance VS = 0 V, f = 1 MHz 25°C 40 pF
TSD Thermal Shutdown 160 °C
THYST Thermal Hysteresis 20 °C