SCDU019 June   2021

 

  1.   Abstract
  2.   Trademarks
  3. 11. Introduction
    1. 1.1 Information About Cautions and Warnings
  4. 23. Features of This EVM
  5. 34. TMUX741-746EVM Setup
  6. 45. TMUX741-746EVM Jumper Connections and Test Points
  7. 56. Schematics
  8. 67. Bill of Materials
  9. 78. PCB Layouts
  10. 8Related Documentation

2 3. Features of This EVM

The EVM has the following features:

  • Four power supply decoupling capacitors from VDD to Ground (2 × 3.3 µF, 1 µF, 0.1 µF)
  • One additional power supply decoupling capacitor pad from VDD to Ground (0.1 µF)
  • One power supply decoupling capacitors from VSS to Ground (2 × 3.3 µF, 1 µF, 0.1 µF)
  • One additional power supply decoupling capacitor pad from VDD to Ground (0.1 µF)
  • Protection diode pads available near VDD and VSS input.
  • 10 µF supply decoupling capacitor to Ground on both VFP and VFN supplies
  • Protection diode pads available near VFP and VFN inputs
  • Up to four auxiliary pathways available with jumpers
  • Up to eight analog I/O pathways available
  • All analog I/O pathways have pads available to load device
  • All analog I/O pathways have pads available to support SMA connections to device.
  • Fault indicator flag LED circuit included on EVM