SCDU028 August   2021

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines
  5. 3Information About Cautions and Warnings
  6. 4Features
  7. 5Header Connections and Test Points
  8. 6Setup
  9. 7Layout
  10. 8Schematics
  11. 9Bill of Materials

4 Features

The TMUXRUM-RRPEVM has the following features:

  • 3 power supply decoupling capacitors from VDD to GND (three 3.3 µF capacitors)
  • 1 protection diode pad from VDD to GND available near power supply (6.9 mm × 5.8 mm)
  • 3 power supply decoupling capacitors from VSS to GND (three 3.3 μF capacitors)
  • 1 protection diode pad from VSS to GND available near power supply (6.9 mm × 5.8 mm)
  • Terminal block power supply connection
  • DUT footprint compatible with 16-pin RUM and RRP (WQFN) packages
  • 16 length-matched signal inputs corresponding to the 16 pins of the DUT
  • Selectable connections to VDD, VSS, or GND for each signal input using 2.54 mm shunt
  • Footprints for pull-up and pull-down resistors for each signal input (2 × 0603 footprint on each of 24 signals)
  • Footprints for series resistors for each signal input (two 0805 footprints on each of 16 signals)
  • Footprints for decoupling capacitors for each input (one 1206 footprint and one 1812 footprint on each of 16 signals)
  • 2 test points for each signal input

  • Selectable thermal pad connection

  • Multiple GND test point connections around board