SCDU034 may   2023

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Header and Jumper Information
    3. 2.3 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

3.2 PCB Layouts

GUID-20230502-SS0I-NRLB-NG3B-HCZRZVK3TPDJ-low.png Figure 3-2 TMUX4827YBHEVM Top Layer Layout
GUID-20230502-SS0I-DH6W-GRV8-NTRHHGF9XNNH-low.png Figure 3-3 TMUX4827YBHEVM Bottom Layer Layout