SCDU038 April   2024 TMUX6221 , TMUX7221

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Setup
    3. 2.3 Jumper Information
    4. 2.4 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

Features

  • One power supply decoupling capacitor from VDD to ground (3.3µF, 6mm × 5mm)
  • Two additional power supply decoupling capacitor pads from VDD to ground (6mm × 5mm)
  • One power supply decoupling capacitor from VSS to ground (3.3µF, 6mm × 5mm)
  • Two additional power supply decoupling capacitor pads from VSS to ground (6mm × 5mm)
  • Pads available near VDD and VSS input for TVS Diodes ( L × W: 8.13mm × 6.22mm)
  • One pad for switches and multiplexers in the 10-pin DGS package
  • 10 generic 6-pin headers for power, analog or digital signals being switched, and control signals
  • All 10 generic signal pathways have 2 0805 size 0Ω resistors installed between IC pad and header
  • All 10 generic signal pathways have 0603 sized pads to add a pull-up, pull-down, or resistive load to the signal pathway
  • All 10 generic signal pathways contain an 1812 sized pad to add a capacitive load to the signal pathway
  • All 10 generic signal pathways contain a 1206 sized pad to add a capacitive load to the signal pathway
  • One common 3-port terminal block for GND, VDD, and VSS power signals