9 Revision History
Changes from Revision J (July 2023) to Revision K (September 2024)
- Added body size to Package
Information tableGo
- Updated Pin Functions tableGo
- Added Application and Implementation sectionGo
Changes from Revision I (May 2005) to Revision J (July 2023)
- Added Package Information table, Pin Functions table,
ESD Ratings table, Thermal Information table, Device and
Documentation Support section, and Mechanical, Packaging, and
Orderable Information section Go
- Updated thermal values for RθJA: D = 73 to 99.5, PW = 108 to 122.3,
all values in °C/W Go