12 Revision History
Changes from Revision P (June 2016) to Revision Q (March 2024)
- Updated the numbering format for tables, figures, and
cross-references throughout the document Go
Changes from Revision O (June 2014) to Revision P (June 2016)
- Updated Applications and
Device Information tableGo
- Updated pinout images and Pin Functions
tableGo
- Added temperature ranges for Storage temperature, Tstg and Junction temperature, TJ in Absolute Maximum Ratings
Go
- Changed Handling Ratings to ESD Ratings and changed MIN, MAX column to a VALUE columnGo
Changes from Revision N (November 2012) to Revision O (June 2014)
- Updated document to new TI data sheet format.Go
- Removed ordering information.Go
- Added Applications.Go
- Fixed typo in YFP package drawing. Go
- Added Handling Ratings tableGo
- Added Thermal Information table.Go
- Added Typical Characteristics.Go
Changes from Revision M (September 2012) to Revision N (November 2012)
- Changed DPW package pinoutGo
Changes from Revision L (May 2012) to Revision M (September 2012)
Changes from Revision K (October 2011) to Revision L (May 2012)
- Revised document to fix package addendum issue.Go
Changes from Revision J (May 2010) to Revision K (October 2011)