SCES551F February 2004 – March 2024 SN74AVC16T245
PRODUCTION DATA
THERMAL METRIC(1) | SN74AVC16T245 | UNIT | |||
---|---|---|---|---|---|
DGV (TVSOP) | DGG (TSSOP) | ZQL (BGA MICROSTAR JUNIOR) | |||
48 PINS | 48 PINS | 56 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 82.5 | 69.9 | 64.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 34.2 | 23.9 | 16.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 45.1 | 36.6 | 30.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.7 | 1.7 | 0.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 44.6 | 36.2 | 64.6 | °C/W |