SCES861F June   2015  – November 2024 TXS0108E-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = –40°C to 125°C
    6. 5.6  Timing Requirements: VCCA = 1.5V ± 0.1 V
    7. 5.7  Timing Requirements: VCCA = 1.8V ± 0.15V
    8. 5.8  Timing Requirements: VCCA = 2.5V ± 0.2V
    9. 5.9  Timing Requirements: VCCA = 3.3V ± 0.3V
    10. 5.10 Switching Characteristics: VCCA = 1.5V ± 0.1V
    11. 5.11 Switching Characteristics: VCCA = 1.8V ± 0.15V
    12. 5.12 Switching Characteristics: VCCA = 2.5V ± 0.2V
    13. 5.13 Switching Characteristics: VCCA = 3.3V ± 0.3V
    14. 5.14 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pull-up or Pull-down Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Electrostatic Discharge Caution

TXS0108E-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.