This section will cover the six steps to take when evaluating a leaded Logic device using this EVM.

1. Identify the package you will be using for the device being evaluated. As stated previously, this EVM has seven sections each of which supporting a non-leaded footprint. Break off the selected section (optional).
2. Solder down the device. Since this EVM supports small, non-leaded packages, this will likely require a hot air rework station. Figure 2-2 illustrates an example of proper placement of a DRY device on the footprint that also supports the DTT package.
   Figure 2-2 6-pin DRY Placement
3. Ensure EVM is configured accordingly for dual supply or single supply device. EVM comes default configured for dual supply devices, but is easily configured using a 0-Ω resistor for single supply devices. Figure 2-3 illustrates how this is done.
   Figure 2-3 Single Supply Configuration
4. Interface with device pins. The kit includes twelve 4-pin headers and four supply test points. The headers can be cut to accomodate the 5-pin and 6-pin footprints. An example of this, with the addition of bypass capacitors for the supplies, can be seen in Figure 2-4. Note: The DPW section has the middle pad grounded to accommodate the pin-3 GND of DPW devices.
   Figure 2-4 Fully Populated Section
5. Before applying power to the EVM, ensure the proper supply configuration is in place to avoid shorting two supplies together.