SCHS331B February   2003  – July 2024 CD74AC238

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5 V
    7. 4.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 4.8 Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 4.9 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application Information
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Pin Configuration and Functions

CD74AC238 CD74AC238 D or PW Package; 16-Pin SOIC or TSSOP (Top View)Figure 3-1 CD74AC238 D or PW Package; 16-Pin SOIC or TSSOP (Top View)
CD74AC238 CD74AC238 BQB Package, 16-Pin WQFN (Top View)Figure 3-2 CD74AC238 BQB Package, 16-Pin WQFN (Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A 1 I Input A
B 2 I Input B
C 3 I Input C
G2A 4 I Strobe Input 2A, active low
G2B 5 I Strobe Input 2B, active low
G1 6 I Strobe Input
Y7 7 O Output 7
GND 8 G Ground
Y6 9 O Output 6
Y5 10 O Output 5
Y4 11 O Output 4
Y3 12 O Output 3
Y2 13 O Output 2
Y1 14 O Output 1
Y0 15 O Output 0
VCC 16 P Positive Supply
Thermal Pad(2) — Thermal Pad
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) BQB package only