9 Revision History
Changes from Revision G (July 2022) to Revision H (August 2024)
- Added DGS package to Device
Information table, Pin Configuration and
Functions section, and Thermal
Information tableGo
- Added package size to Device
Information tableGo
- Added Application and Implementation sectionGo
Changes from Revision F (January 2022) to Revision G (July 2022)
- Junction-to-ambient thermal resistance values increased. DW was 58 is now 109.1, DB
was 70 is now 122.7, N was 69 is now 84.6, NS was 60 is now 113.4, PW was 83 is now
131.8Go