SCLS242M October   1995  – August 2024 SN54AHC573 , SN74AHC573

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 3.3 V ± 0.3 V
    7. 5.7  Timing Requirements, VCC = 5 V ± 0.5 V
    8. 5.8  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics, VCC = 5 V ± 0.5 V
    10. 5.10 Noise Characteristics
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Links
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74AHC573UNIT
DWDBDGVNNSPW
20 PINS
RθJAJunction-to-ambient thermal resistance81.197.9117.253.377.6116.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance48.959.632.740.042.758.5
RθJBJunction-to-board thermal resistance53.853.158.734.245.778.7
ψJTJunction-to-top characterization parameter19.521.31.1526.410.212.6
ψJBJunction-to-board characterization parameter53.152.758.034.145.277.9
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/AN/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).