SCLS418I June   1998  – July 2024 SN74AHCT367

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

3 Description

The SN74AHCT367 device is designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) BODY SIZE(3)
SN74AHCT367 D (SOIC, 16) 9.9mm × 6mm 9.9mm x 3.90mm
DB (SSOP, 16) 6.2mm × 7.8mm 6.2mm x 5.30mm
DGV (TVSOP, 16) 3.6mm × 6.4mm 3.6mm x 4.4mm
PW (TSSOP, 16) 5mm × 6.4mm 5.00mm x 4.40mm
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
(3) The body size (length × width) is a nominal value and does not include pins.
SN74AHCT367