SCPS193D July   2010  – January 2023 TCA6424A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Reset Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Voltage Translation
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 I2C Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Address
    5. 8.5 Programming
      1. 8.5.1 Power-On Reset
      2. 8.5.2 Reset Input ( RESET)
      3. 8.5.3 Interrupt Output ( INT)
      4. 8.5.4 Bus Transactions
        1. 8.5.4.1 Writes
        2. 8.5.4.2 Reads
    6. 8.6 Register Maps
      1. 8.6.1 Control Register and Command Byte
      2. 8.6.2 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Detailed Design Procedure
        1. 9.1.1.1 Minimizing ICC When I/Os Control LEDs
    2. 9.2 Power Supply Recommendation
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
      1.      Mechanical, Packaging, and Orderable Information

10.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.