SCPS225E August   2011  – October 2024 TCA9509

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 I2C Interface Timing Requirements
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Two-Channel Bidirectional Buffer
      2. 7.3.2 Integrated A-Side Current Source
      3. 7.3.3 Standard Mode and Fast Mode Support
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clock Stretching Support
        2. 8.2.2.2 VILC and Pulldown Strength Requirements
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

5.4 Thermal Information

THERMAL METRIC(1)TCA9509UNIT
RVH (X2QFN)DGK (VSSOP)
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance(2)160.3222.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance66.4109.5°C/W
RθJBJunction-to-board thermal resistance115.9144.5°C/W
ψJTJunction-to-top characterization parameter0.834.5°C/W
ψJBJunction-to-board characterization parameter116.2142.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance80.5n/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.