SCPS260C August   2017  – February 2022 TIC12400-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VS Pin
      2. 8.3.2  VDD Pin
      3. 8.3.3  Device Initialization
      4. 8.3.4  Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1 VS Supply POR
        2. 8.3.5.2 Hardware Reset
        3. 8.3.5.3 Software Reset
      6. 8.3.6  VS Under-Voltage (UV) Condition
      7. 8.3.7  VS Over-Voltage (OV) Condition
      8. 8.3.8  Switch Inputs Settings
        1. 8.3.8.1 Input Current Source and Sink Selection
        2. 8.3.8.2 Input Mode Selection
        3. 8.3.8.3 Input Enable Selection
        4. 8.3.8.4 Thresholds Adjustment
        5. 8.3.8.5 Wetting Current Configuration
      9. 8.3.9  Interrupt Generation and INT Assertion
        1. 8.3.9.1 INT Pin Assertion Scheme
        2. 8.3.9.2 Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3 Microcontroller Wake-Up
        4. 8.3.9.4 Interrupt Enable or Disable and Interrupt Generation Conditions
        5. 8.3.9.5 Detection Filter
      10. 8.3.10 Temperature Monitor
        1. 8.3.10.1 Temperature Warning (TW)
        2. 8.3.10.2 Temperature Shutdown (TSD)
      11. 8.3.11 Parity Check and Parity Generation
      12. 8.3.12 Cyclic Redundancy Check (CRC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Mode
      2. 8.4.2 Polling Mode
        1. 8.4.2.1 Standard Polling
        2. 8.4.2.2 Matrix polling
      3. 8.4.3 Additional Features
        1. 8.4.3.1 Clean Current Polling (CCP)
        2. 8.4.3.2 Wetting Current Auto-Scaling
        3. 8.4.3.3 VS Measurement
        4. 8.4.3.4 Wetting Current Diagnostic
        5. 8.4.3.5 ADC Self-Diagnostic
    5. 8.5 Programming
      1. 8.5.1 SPI Communication Interface Buses
        1. 8.5.1.1 Chip Select ( CS)
        2. 8.5.1.2 System Clock (SCLK)
        3. 8.5.1.3 Slave In (SI)
        4. 8.5.1.4 Slave Out (SO)
      2. 8.5.2 SPI Sequence
        1. 8.5.2.1 Read Operation
        2. 8.5.2.2 Write Operation
        3. 8.5.2.3 Status Flag
    6. 8.6 Register Maps
    7. 8.7 Programming Guidelines
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Using TIC12400-Q1 in a 12 V Automotive System
    3. 9.3 Resistor-coded Switches Detection in Automotive Body Control Module
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

8.3.10.2 Temperature Shutdown (TSD)

After the device enters TW condition, if the junction temperature continues to rise and goes above the temperature shutdown threshold (TTSD), the TIC12400-Q1 enters the Temperature Shutdown (TSD) condition and performs the following operations:

  1. Opens all the switches connected to the current sources and sinks to prevent any further heating due to excessive current flow.
  2. Generate an interrupt by asserting the INT pin (if not already asserted) low and flag the TSD bit in the INT_STAT register to logic 1. The TEMP bit in the SPI flag is also flagged to logic 1 for all SPI transactions.
  3. The TSD_STAT bit of the IN_STAT_MISC register is flagged to logic 1. The TW_STAT bit also stays at logic 1.
  4. SPI communication stays on and all register settings stay intact without resetting. Previous switch status, if needed, can be retrieved without any interruption.
  5. Maintain the setting as long as the junction temperature stays above TTSD- THYS.

The INT pin is released and the INT_STAT register content is cleared on the rising edge of CS provided the INT_STAT register has been read during CS low. The TIC12400-Q1 continues to monitor the temperature, but does not issue further interrupts if the temperature continues to stay above TTSD - THYS. The status bit TSD_STAT in register IN_STAT_MISC continues to stay at logic 1 as long as the temperature shutdown condition exists.

When the temperature drops below TTSD - THYS, the INT pin is asserted low (if released previously) to notify the microcontroller that the temperature shutdown condition no longer exists. The TSD bit of the interrupt register INT_STAT is flagged logic 1. In the IN_STAT_MISC register, the TSD_STAT bit is de-asserted back to logic 0, while the TW_STAT bit stays at logic 1. The device resumes operation using the wetting current setting described in section Temperature Warning if the temperature stays above TTW - THYS. Note: the polling restarts from the first enabled channel and the SSC interrupt is generated at the end of the first polling cycle. The detected switch status from the first polling cycle becomes the default switch status for subsequent polling.