SCPS274B June   2021  – March 2023 TCA39306

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Definition of threshold voltage
      2. 8.1.2 Correct Device Set Up
      3. 8.1.3 Disconnecting a Responder from the Main Bus Using the EN Pin
      4. 8.1.4 Supporting Remote Board Insertion to Backplane with TCA39306
      5. 8.1.5 Switch Configuration
      6. 8.1.6 Controller on Side 1 or Side 2 of Device
      7. 8.1.7 LDO and TCA39306 Concerns
      8. 8.1.8 Current Limiting Resistance on VREF2
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable (EN) Pin
      2. 8.3.2 Voltage Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 General Applications of I2C
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bidirectional Voltage Translation
        2. 9.2.2.2 Sizing Pullup Resistors
        3. 9.2.2.3 Bandwidth
      3. 9.2.3 Application Curve
    3. 9.3 Systems Examples: I3C Usage Considerations
      1. 9.3.1 I3C Bus Switching
      2. 9.3.2 I3C Bus Voltage Translation
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TCA39306 UNIT
DCU DDF DTM
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 275.5 273.0 289.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 127.1 180.7 185.5 °C/W
RθJB Junction-to-board thermal resistance 186.9 188.4 193.8 °C/W
ΨJT Junction-to-top characterization parameter 65.7 47.8 27.4 °C/W
ΨJB Junction-to-board characterization parameter 185.9 187.8 193.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.