SCPS290A April   2024  – June 2024 TCAL6416R

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 I2C Bus Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Translation
      2. 7.3.2 I/O Port
      3. 7.3.3 Adjustable Output Drive Strength
      4. 7.3.4 Interrupt Output (INT)
      5. 7.3.5 Reset Input (RESET)
      6. 7.3.6 Software Reset Call
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
    6. 7.6 Register Maps
      1. 7.6.1 Device Address
      2. 7.6.2 Control Register and Command Byte
      3. 7.6.3 Register Descriptions
      4. 7.6.4 Bus Transactions
        1. 7.6.4.1 Writes
        2. 7.6.4.2 Reads
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Minimizing ICC When I/Os Control LEDs
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.1 Layout Guidelines

For device reliability, follow common printed circuit board (PCB) layout practices. Additional concerns related to high-speed data transfer, such as matched impedance and differential pairs, are not a concern for I2C signal speeds.

It is a best practice to avoid right angles in signal traces, to fan out signal traces away from each other upon leaving the vicinity of an integrated circuit (IC), and to use thicker trace widths to carry higher amounts of current that commonly pass through power and ground traces in all PCB layouts. Bypass and decoupling capacitors are commonly used to control the voltage on the supply pins. Using a larger capacitor provides additional power in the event of a short power supply glitch, and using a smaller capacitor filters out high-frequency ripple. These capacitors should be placed as close to the TCAL6416R as possible. Figure 8-9 shows these best practices.