SCPS301 September   2024 TPLD801-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
  7. 6Parameter Measurement Information
  8. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I/O Pins
      2. 7.3.2 Connection Mux
      3. 7.3.3 Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT macro-cell
        2. 7.3.3.2 3-Bit LUT macro-cell
        3. 7.3.3.3 2-Bit LUT or D Flip-Flop/Latch macro-cell
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop/Latch with Set/Reset macro-cell
        5. 7.3.3.5 3-Bit LUT or Pipe Delay macro-cell
        6. 7.3.3.6 4-Bit LUT or 8-Bit Counter/Delay macro-cell
      4. 7.3.4 8-Bit Counters and Delay Generators (CNT/DLY)
        1. 7.3.4.1 Delay Mode
        2. 7.3.4.2 Reset Counter Mode
      5. 7.3.5 Programmable Deglitch Filter or Edge Detector Macro-cell
      6. 7.3.6 Selectable Frequency Oscillator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 One-Time Programmable Memory (OTP)
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Option Addendum
    2. 9.2 Tape and Reel Information
    3. 9.3 Mechanical Data

5.4 Thermal Information

THERMAL METRIC(1) TPLD801-Q1 UNIT
DRL (SOT-5X3)
8-PIN
RθJA Junction-to-ambient thermal resistance 118.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.1 °C/W
RθJB Junction-to-board thermal resistance 26.5 °C/W
ΨJT Junction-to-top characterization parameter 3.9 °C/W
ΨJB Junction-to-board characterization parameter 25.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.