SFFS095 April   2021 ISO6731 , ISO6731-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 16-SOIC (wide-body SOIC) Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 16-DW (wide-body SOIC) Package

16-DW (wide-body SOIC) Package

Figure 4-1 shows the ISO6731/ISO6731-Q1 and ISO6731F/ISO6731F-Q1 pin diagram for the 16-DW package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the ISO6731/ISO6731-Q1 data sheet.

GUID-8C306BC1-54A5-463E-BDE6-CE8A814E857F-low.gifFigure 4-1 Pin Diagram (16-DW) Package
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC11No power to the device on side-1. Observe that the absolute maximum ratings for all pins of the device are met; otherwise device damage may be plausible. OUTC state undetermined.A
GND12Device continues to function as expected.Normal operation. D
INA3Input signal shorted to ground, so output (OUTA) stuck to low. Communication from INA to OUTA corrupted.B
INB4Input signal shorted to ground, so output (OUTB) stuck to low. Communication from INB to OUTB corrupted.B
OUTC5OUTC stuck low. Data communication from INC to OUTC lost. Device damage possible if INC is driven high for extended period of time.A
NC6Device continues to function as expected. Normal operation.D
EN17Disables output buffer for OUTC. Communication corrupted for Channel C.B
GND18Device continues to function as expected. Normal operation.D
GND29Device continues to function as expected. Normal operation.D
EN210Disables the output buffer for OUTA/OUTB channels. Communication corrupted.B
NC11Device continues to function as expected. Normal operation.D
INC12Input signal shorted to ground, so output (OUTC) stuck to low. Communication from INC to OUTC corrupted.B
OUTB13OUTB stuck low. Data communication from INB to OUTB lost. Device damage possible if INB is driven high for extended period of time.A
OUTA14OUTA stuck low. Data communication from INA to OUTA lost. Device damage possible if INA is driven high for extended period of time.A
GND215Device continues to function as expected. Normal operation.D
VCC216No power to the device on side-2. OUTA/OUTB pins state undetermined.B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC11Operation undetermined. Either device is unpowered and OUTA/OUTB=default logic state, OUTC=undetermined or through internal ESD diode on INA/INB pin, device can power up if any IN is driven to logic high. If IN has current sourcing capability to provide regular operating current of device, ESD diode conducts that current and device damage plausible.A
GND12Device gets return ground through pin8. Normal operation.D
INA3No communication to INA channel possible. OUTA stuck to default state (High for ISO6731/ISO6731-Q1 and Low for ISO6731F/ISO6731F-Q1).B
INB4No communication to INB channel possible. OUTB stuck to default state (High for ISO6731/ISO6731-Q1 and Low for ISO6731F/ISO6731F-Q1).B
OUTC5State of OUTC undetermined. Data communication from INC to OUTC lost.B
NC6Device continues to function as expected. Normal operation.D
EN17Control on OUTC output buffer lost, but communication from IN to OUT channels continues normally.

B

GND18Device gets return ground through pin2. Normal operation.D
GND29Device gets return ground through pin15. Normal operation.D
EN210Control on OUTA/OUTB output buffer lost, but communication from IN to OUT channels continues normally.

B

NC11Device continues to function as expected. Normal operation.D
INC12No communication to INC channel possible. OUTC stuck to default state (High for ISO6731/ISO6731-Q1 and Low for ISO6731F/ISO6731F-Q1).B
OUTB13State of OUTB undetermined. Data communication from INB to OUTB lost.B
OUTA14State of OUTA undetermined. Data communication from INA to OUTA lost.B
GND215Device gets return ground through pin9. Normal operation.D
VCC216Device unpowered on side-2 and state of OUTA/OUTB undetermined.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
VCC1 1 GND1 No power to the device on side-1. Observe that the absolute maximum ratings for all pins of the device are met; otherwise device damage may be plausible. A
GND1 2 INA Input signal shorted to ground, so output (OUTA) stuck to low. Communication from INA to OUTA corrupted. B
INA 3 INB Communication corrupted for either INA or INB channel. B
INB 4 OUTC Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. A
OUTC 5 NC Device continues to function as expected. Normal operation. D
NC 6 EN1 Device continues to function as expected. Normal operation. D
EN1 7 GND1 Disables OUTC output buffer. Communication for channel C corrupted. B
GND1 8 EN1 Already considered in above row. B
GND2 9 EN2 Disables the output buffer for all OUTA/OUTB Output channels. Communication corrupted. B
EN2 10 NC Device continues to function as expected. Normal operation. D
NC 11 INC Device continues to function as expected. Normal operation. D
INC 12 OUTB Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. B
OUTB 13 OUTA Communication corrupted for either OUTA or OUTB channel. Device damage possible if INA and INB try to drive opposite logic state for extended duration creating a short between supply and ground on side-2. A
OUTA 14 GND2 OUTA stuck low. Data communication from INA to OUTA lost. Device damage possible if INA is driven high for extended period of time. A
GND2 15 VCC2 No power to the device on side-2. OUTA/OUTB pins state undetermined. B
VCC2 16 GND2 Already considered in above row. B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC11No effect. Normal operation.D
GND12This can create potential difference between pin2 and pin8, causing high current to flow in device and potential device damage.A
INA3INA pin stuck high. Communication corrupted. OUTA state high.B
INB4INB pin stuck high. Communication corrupted. OUTB state high.B
OUTC5OUTC stuck high. Data communication from INC to OUTC lost. Device damage possible if INC is driven high for extended period of time.A
NC6Device continues to function as expected. Normal operation.D
EN17Functionality to disable output buffer OUTC lost. Communication for all channels normal.

B

GND18This can create potential difference between pin2 and pin8, causing high current to flow in device and potential device damage.A
GND29This can create potential difference between pin9 and pin15, causing high current to flow in device and potential device damage.A
EN210Functionality to disable output buffer for OUTA/OUTB lost. Communication for all channels normal.

B

NC11Device continues to function as expected. Normal operation.D
INC12INC pin stuck high. Communication corrupted. OUTC state high.B
OUTB13OUTB stuck high. Communication disrupted. If INB is low for extended duration, OUTB being stuck high creates a short and can damage the device.A
OUTA14OUTA stuck high. Communication disrupted. If INA is low for extended duration, OUTA being stuck high creates a short and can damage the device.A
GND215This can create potential difference between pin9 and pin15, causing high current to flow in device and potential device damage.A
VCC216Device continues to function as expected. Normal operation.D