SFFS098 April 2021 ISO6742 , ISO6742-Q1
4.1 16-DW (wide-body SOIC) Package
Figure 4-1 shows the ISO6742/ISO6742-Q1 and ISO6742F/ISO6742F-Q1 pin diagram for the 16-DW package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the ISO6742/ISO6742-Q1 data sheet.
Figure 4-1 Pin Diagram (16-DW) PackageTable 4-2 Pin FMA for Device Pins
Short-Circuited to Ground
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| VCC1 | 1 | No power to the device on side-1. Observe that the absolute maximum ratings for all pins of the device are met; otherwise device damage may be plausible. OUTC/OUTD state undetermined. OUTA/OUTB= default state. | A |
| GND1 | 2 | Device continues to function as expected. Normal operation. | D |
| INA | 3 | Input signal shorted to ground, so output (OUTA) stuck to low. Communication from INA to OUTA corrupted. | B |
| INB | 4 | Input signal shorted to ground, so output (OUTB) stuck to low. Communication from INB to OUTB corrupted. | B |
| OUTC | 5 | OUTC stuck low. Data communication from INC to OUTC lost. Device damage possible if INC is driven high for extended period of time. | A |
| OUTD | 6 | OUTD stuck low. Data communication from IND to OUTD lost. Device damage possible if IND is driven high for extended period of time. | A |
| EN1 | 7 | Disables output buffer for OUTC/OUTD. Communication corrupted for Channel C/D. | B |
| GND1 | 8 | Device continues to function as expected. Normal operation. | D |
| GND2 | 9 | Device continues to function as expected. Normal operation. | D |
| EN2 | 10 | Disables the output buffer for OUTA/OUTB channels. Communication corrupted. | B |
| IND | 11 | Input signal shorted to ground, so output (OUTD) stuck to low. Communication from IND to OUTD corrupted. | B |
| INC | 12 | Input signal shorted to ground, so output (OUTC) stuck to low. Communication from INC to OUTC corrupted. | B |
| OUTB | 13 | OUTB stuck low. Data communication from INB to OUTB lost. Device damage possible if INB is driven high for extended period of time. | A |
| OUTA | 14 | OUTA stuck low. Data communication from INA to OUTA lost. Device damage possible if INA is driven high for extended period of time. | A |
| GND2 | 15 | Device continues to function as expected. Normal operation. | D |
| VCC2 | 16 | No power to the device on side-2. OUTA/OUTB pins state undetermined. OUTC/OUTD= default state. | B |
Table 4-3 Pin FMA for Device Pins
Open-Circuited
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| VCC1 | 1 | Operation undetermined. Either device is unpowered and OUTA/OUTB=default logic state, OUTC/OUTD=undetermined or through internal ESD diode on INA/INB pin, device can power up if any of INA/INB is driven to logic high. If IN has current sourcing capability to provide regular operating current of device, ESD diode conducts that current and device damage plausible. | A |
| GND1 | 2 | Device gets return ground through pin8. Normal operation. | D |
| INA | 3 | No communication to INA channel possible. OUTA stuck to default state (High for ISO6742/ISO6742-Q1 and Low for ISO6742F/ISO6742F-Q1). | B |
| INB | 4 | No communication to INB channel possible. OUTB stuck to default state (High for ISO6742/ISO6742-Q1 and Low for ISO6742F/ISO6742F-Q1). | B |
| OUTC | 5 | State of OUTC undetermined. Data communication from INC to OUTC lost. | B |
| OUTD | 6 | State of OUTD undetermined. Data communication from IND to OUTD lost. | B |
| EN1 | 7 | Control on OUTC/OUTD output buffer lost, but communication from IN to OUT channels continues normally. | B |
| GND1 | 8 | Device gets return ground through pin2. Normal operation. | D |
| GND2 | 9 | Device gets return ground through pin15. Normal operation. | D |
| EN2 | 10 | Control on OUTA/OUTB output buffer lost, but communication from IN to OUT channels continues normally. | B |
| IND | 11 | No communication to IND channel possible. OUTD stuck to default state (High for ISO6742/ISO6742-Q1 and Low for ISO6742F/ISO6742F-Q1). | B |
| INC | 12 | No communication to INC channel possible. OUTC stuck to default state (High for ISO6742/ISO6742-Q1 and Low for ISO6742F/ISO6742F-Q1). | B |
| OUTB | 13 | State of OUTB undetermined. Data communication from INB to OUTB lost. | B |
| OUTA | 14 | State of OUTA undetermined. Data communication from INA to OUTA lost. | B |
| GND2 | 15 | Device gets return ground through pin9. Normal operation. | D |
| VCC2 | 16 | Device unpowered on side-2 and state of OUTA/OUTB undetermined. OUTC/OUTD to default state. | B |
Table 4-4 Pin FMA for Device Pins
Short-Circuited to Adjacent Pin
| Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|---|
| VCC1 | 1 | GND1 | No power to the device on side-1. Observe that the absolute maximum ratings for all pins of the device are met; otherwise device damage may be plausible. | A |
| GND1 | 2 | INA | Input signal shorted to ground, so output (OUTA) stuck to low. Communication from INA to OUTA corrupted. | B |
| INA | 3 | INB | Communication corrupted for either INA or INB channel. | B |
| INB | 4 | OUTC | Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. | A |
| OUTC | 5 | OUTD | Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. | A |
| OUTD | 6 | EN1 | Communication corrupted on Channel D. If EN1 is pulled to supply externally, possible device damage if OUTD driven low for extended duration. | A |
| EN1 | 7 | GND1 | Disables OUTC/OUTD output buffer. Communication for channel C/D corrupted. | B |
| GND1 | 8 | EN1 | Already considered in above row. | B |
| GND2 | 9 | EN2 | Disables the output buffer for OUTA/OUTB Output channels. Communication corrupted. | B |
| EN2 | 10 | IND | Communication corrupted on Channel D if EN2 is pulled high or low externally. When IND toggles, communication corrupted on other channels whose output buffer is controlled by EN2. | B |
| IND | 11 | INC | Communication corrupted for either IND or INC channel. | B |
| INC | 12 | OUTB | Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. | A |
| OUTB | 13 | OUTA | Communication corrupted for either OUTA or OUTB channel. Device damage possible if INA and INB try to drive opposite logic state for extended duration creating a short between supply and ground on side-2. | A |
| OUTA | 14 | GND2 | OUTA stuck low. Data communication from INA to OUTA lost. Device damage possible if INA is driven high for extended period of time. | A |
| GND2 | 15 | VCC2 | No power to the device on side-2. OUTA/OUTB pins state undetermined. OUTC/OUTD default state. | B |
| VCC2 | 16 | GND2 | Already considered in above row. | B |
Table 4-5 Pin FMA for Device Pins Short-Circuited to
supply
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| VCC1 | 1 | No effect. Normal operation. | D |
| GND1 | 2 | This can create potential difference between pin2 and pin8, causing high current to flow in device and potential device damage. | A |
| INA | 3 | INA pin stuck high. Communication corrupted. OUTA state high. | B |
| INB | 4 | INB pin stuck high. Communication corrupted. OUTB state high. | B |
| OUTC | 5 | OUTC stuck high. Data communication from INC to OUTC lost. Device damage possible if INC is driven low for extended period of time. | A |
| OUTD | 6 | OUTD stuck high. Data communication from INC to OUTC lost. Device damage possible if IND is driven low for extended period of time. | A |
| EN1 | 7 | Functionality to disable output buffer OUTD/OUTC lost. Communication for all channels normal. | B |
| GND1 | 8 | This can create potential difference between pin2 and pin8, causing high current to flow in device and potential device damage. | A |
| GND2 | 9 | This can create potential difference between pin9 and pin15, causing high current to flow in device and potential device damage. | A |
| EN2 | 10 | Functionality to disable output buffer for OUTA/OUTB lost. Communication for all channels normal. | B |
| IND | 11 | IND pin stuck high. Communication corrupted. OUTD state high. | B |
| INC | 12 | INC pin stuck high. Communication corrupted. OUTC state high. | B |
| OUTB | 13 | OUTB stuck high. Communication disrupted. If INB is low for extended duration, OUTB being stuck high creates a short and can damage the device. | A |
| OUTA | 14 | OUTA stuck high. Communication disrupted. If INA is low for extended duration, OUTA being stuck high creates a short and can damage the device. | A |
| GND2 | 15 | This can create potential difference between pin9 and pin15, causing high current to flow in device and potential device damage. | A |
| VCC2 | 16 | Device continues to function as expected. Normal operation. | D |