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This document contains information for TCAN1162-Q1 (DMT package) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference.
TCAN1162-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides Functional Safety Failure In Time (FIT) rates for TCAN1162-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate | 22 |
Die FIT Rate | 15 |
Package FIT Rate | 7 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS, BICMOS Digital, analog / mixed | 60 FIT | 70°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
The failure mode distribution estimation for TCAN1162-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
CAN transceiver transmitter fail | 21 |
CAN transceiver receiver fail | 8 |
Power rail fail | 23 |
Input/output fail | 29 |
Digital core fail | 16 |
Voltage monitor fail | 3 |
This section provides a Failure Mode Analysis (FMA) for the pins of the TCAN1162-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |
Figure 4-1 shows the TCAN1162-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TCAN1162-Q1 data sheet.
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | Device will enter dominant timeout mode. Unable to transmit data from processor to CAN bus | B |
GND | 2 | None | D |
VFLT | 3 | Internal power rail held to ground, which results in unpowered device and high ISUP current. No communication with device or CAN bus possible | B |
RXD | 4 | Transceiver output biased dominant. Unable to send data from CAN bus to processor | B |
VIO | 5 | Digital pins unpowered, high IIO current. No communication between device and processor possible | B |
TS | 6 | Transceiver status output held at ground. Unable to signal ready transceiver to processor | B |
INH | 7 | INH will not function, excessive VSUP current and not able to perform power enable function | B |
NC | 8 | This pin should be left floating or pulled to ground | D |
WAKE | 9 | Will not be able to transition to high, which will not allow device to recognize a local wake up function | B |
VSUP | 10 | Device unpowered, high ISUP current | B |
NC | 11 | This pin should be left floating or pulled to ground | D |
CANL | 12 | VO(REC) spec violated. Degraded EMC performance | C |
CANH | 13 | Device cannot drive dominant to the bus, no communication possible | B |
nSLP | 14 | Part held in sleep mode. Part will not wake up, resulting in CAN bus communication failure | B |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | Unable to trtansmit data from processor to CAN bus | B |
GND | 2 | Device is unpowered | B |
VFLT | 3 | Degraded EMC performance with no capacitor | C |
RXD | 4 | Unable to send data from CAN bus to processor | B |
VIO | 5 | Digital pins unpowered. No communication between device and processor possible | B |
TS | 6 | Transceiver status output held at ground. Unable to signal ready transceiver to processor | B |
INH | 7 | INH will not be able to perform system power enable functrion | B |
NC | 8 | This pin should be left floating or connected to ground | D |
WAKE | 9 | Will not be able to transition, which will not allow device to recognize a local wake up function | B |
VSUP | 10 | Device is unpowered | B |
NC | 11 | This pin should be left floating or pulled to ground | D |
CANL | 12 | Device cannot drive dominant to the bus, unable to communicate | B |
CANH | 13 | Device cannot drive dominant to the bus, unable to communicate | B |
nSLP | 14 | Processor will be unable to put the device into low-power sleep mode | B |
Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|---|
TXD | 1 | GND | Device will enter dominant time out mode. Unable to transmit data from processor to CAN bus | B |
GND | 2 | VFLT | Internal power rail held to ground, which results in unpowered device and high ISUP current. No communication with device or CAN bus possible. | B |
VFLT | 3 | RXD | RXD output biased recessive, unable to communication bus data to processor | B |
RXD | 4 | VIO | RXD output biased recessive, unable to communication bus data to processor | B |
VIO | 5 | TS | Transceiver status output held at VIO. Unable to signal ready transceiver to processor | B |
TS | 6 | INH | Absolute maximum violation, pin may be damaged. Unable to communicate from transceiver status to processor | A |
NC | 8 | WAKE | Absolute maximum violation on the NC pin, possible damage or unexpected behavior of device | A |
WAKE | 9 | VSUP | Absolute maximum violation, WAKE pin may be damaged | A |
VSUP | 10 | nRST | Absolute maximum violation, nRST pin may be damaged | A |
NC | 11 | CANL | This pin should be left floating or pulled to ground. Potential for unexpected device behavior | B |
CANL | 12 | CANH | Bus biased recessive, no communication possible. IOS current may be reached on CANH/CANL | B |
CANH | 13 | nSLP | Device could be put to sleep when bus is recessive. No communication possible | B |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | Absolute maximum violation, pin may be damaged. Unable to communicate from processor to CAN bus | A |
GND | 2 | Device unpowered, high ISUP current, may damage device | A |
VFLT | 3 | Absolute maximum violation, device may be damaged. | A |
RXD | 4 | Absolute maximum violation, pin may be damaged. Unable to communicate from CAN bus to processor | A |
VIO | 5 | Absolute maximum violation, pin may be damaged. | A |
TS | 6 | Absolute maximum violation, pin may be damaged. | A |
INH | 7 | INH will be biased on and will not be able to turn off | B |
NC | 8 | Absolute maximum violation on the NC pin, possible damage or unexpected behavior of device | A |
WAKE | 9 | Processor will be unable to toggle wake pin. No local wake possible. | B |
VSUP | 10 | None | D |
NC | 11 | Absolute maximum violation, pin may be damaged or unexpected behavior of device | A |
CANL | 12 | RXD biased recessive, no communication from CAN bus to processor possible. IOS current may be reached | B |
CANH | 13 | VO(REC) spec violated. May degrade EMC performance | C |
nSLP | 14 | Absolute maximum violation, pin may be damaged. | A |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
TXD | 1 | TXD will be held high, no communication from processor to CAN bus possible | B |
GND | 2 | Device unpowered, communication not possible | B |
VFLTR | 3 | Excessive current from internal rail, may enter thermal shutdown | B |
RXD | 4 | RXD will be held high, no communication from CAN bus to processor possible | B |
VIO | 5 | None | D |
TS | 6 | Held high, unable to signal transceiver state to processor | B |
INH | 7 | Absolute maximum violation, device may be damaged | A |
NC | 8 | Pin not held low or floating, possible unexpected behavior of device | B |
WAKE | 9 | Processor will be unable to toggle wake pin. No local wake possible | B |
VSUP | 10 | Absolute maximum violation, device may be damaged | A |
NC | 11 | Pin not held low or floating, possible unexpected behavior of device | B |
CANL | 12 | RXD biased recessive, no communication from CAN bus to processor possible. IOS current may be reached | B |
CANH | 13 | VO(REC) spec violated. May degrade EMC performance | C |
nSLP | 14 | Held high, unable to put device to sleep | B |