SFFS192 March 2022 UCC5350-Q1 , UCC5390-Q1
This section provides Functional Safety Failure In Time (FIT) rates for UCC5350-Q1 and UCC5390-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 Power | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate (UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8.UCC5390-Q1 - DWV SOIC-8 ) | 12,19,19 |
Die FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8.UCC5390-Q1 - DWV SOIC-8 ) | 5,4,4 |
Package FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8.UCC5390-Q1 - DWV SOIC-8 ) | 7,15,15 |
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate (UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8,UCC5390-Q1 - DWV SOIC-8 ) | 15,24,24 |
Die FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8,UCC5390-Q1 - DWV SOIC-8 ) | 7,8,8 |
Package FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8,UCC5390-Q1 - DWV SOIC-8 ) | 8,16,16 |
The failure rate and mission profile information in Table 2-1 and Table 2-2 come from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog / mixed | 22 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.