SFFS192 March   2022 UCC5350-Q1 , UCC5390-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for UCC5350-Q1 in Table 3-1 and UCC5390-Q1 in Table 3-2come from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.

Table 3-1 Die Failure Modes and Distribution of UCC5350-Q1
Die Failure Modes Failure Mode Distribution (%)
OUT stuck low 29%
OUT stuck high 29%
OUT level is outside of specified value 29%
UVLO not working 1%
CLAMP not working 12%
Table 3-2 Die Failure Modes and Distribution of UCC5390-Q1
Die Failure Modes Failure Mode Distribution (%)
OUT stuck low 33%
OUT stuck high 33%
OUT level is outside of specified value 33%
UVLO not working 1%

The FMD excludes short circuit faults across the isolation barrier. Faults for short circuit across the isolation barrier can be excluded according to ISO 61800-5-2:2016 if the following requirements are fulfilled:

  1. The signal isolation component is OVC III according to IEC 61800-5-1. If a SELV/PELV power supply is used, pollution degree 2/OVC II applies. All requirements of IEC 61800-5-1:2007, 4.3.6 apply.
  2. Measures are taken to ensure that an internal failure of the signal isolation component cannot result in excessive temperature of its insulating material.

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.