SFFS231B August 2021 – July 2022 TLV3601-Q1 , TLV3602-Q1
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This document contains information for TLV3601-Q1 (DCK and DBV packages) and TLV3602-Q1 (DGK and DSG packages) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram of single channel for reference.
TLV3601-Q1 and TLV3602-Q1 were developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
ADVANCE INFORMATION for preproduction products; subject to change without notice.
This section provides Functional Safety Failure In Time (FIT) rates for the DCK and DBV packages of TLV3601-Q1 and DGK and DSG packages of TLV3602-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | DCK FIT (Failures Per 109 Hours) | DBV FIT (Failures Per 109 Hours) |
---|---|---|
Total Component FIT Rate |
3 |
4 |
Die FIT Rate | 2 | 2 |
Package FIT Rate |
1 |
2 |
FIT IEC TR 62380 / ISO 26262 | DGK FIT (Failures Per 109 Hours) | DBV FIT (Failures Per 109 Hours) |
---|---|---|
Total Component FIT Rate |
7 |
4 |
Die FIT Rate | 3 | 2 |
Package FIT Rate |
4 |
2 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
4 | CMOS, BICMOS Digital, analog / mixed | 12 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.