SFFS286 September   2021 TLVH431B-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TLVH431B-Q1 (DBV and DBZ package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
CLASSFAILURE EFFECTS
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TLVH431B-Q1 pin diagram for the DBV package. For a description of the device pins, see the TLVH431B-Q1 datasheet.

Figure 4-1 Pin Diagram (DBV) Package
  • CATHODE is connected to VDD through a series resistor
  • ANODE is connected to the ground
  • REF is connected to ground and cathode via resistors as shown in the Figure 4-2
  • NC and * pin is left floating
GUID-6C0B2D98-016B-498E-A23A-ECA5F4F90DD8-low.gif Figure 4-2 Test Circuit for VKA > VREF

Figure 4-3 shows the TLVH431B-Q1 pin diagram for the DBZ package. For a description of the device pins, see the the TLVH431B-Q1 datasheet.

Figure 4-3 Pin Diagram (DBZ) Package

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • CATHODE is connected to VDD through a series resistor
  • ANODE is connected to the ground
  • REF is connected to ground and cathode via resistors as shown in the Figure 4-4
GUID-6C0B2D98-016B-498E-A23A-ECA5F4F90DD8-low.gifFigure 4-4 Test Circuit for VKA > VREF
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground on DBV Package
PIN NAMEPIN NUM.DESCRIPTION OF POTENTIAL FAILURE EFFECT(S)FAILURE EFFECT CLASS
NC 1 Normal Operation D
* 2 Works fine when anode is connected to Ground but can affect application functionality otherwise C
CATHODE 3 Potential damage to the device depending on the location of the short. Shorts output voltage to ground, increases system current A
REF 4 Turns off the regulator. No damage to device but can affect application functionality B
ANODE 5 Works fine when anode is connected to Ground but can affect application functionality otherwise C
Table 4-3 Pin FMA for Device Pins Short-Circuited to Ground on DBZ Package
PIN NAME PIN NUM. DESCRIPTION OF POTENTIAL FAILURE EFFECT(S) FAILURE EFFECT CLASS
REF 1 Turns off the regulator. No damage to device but can affect application functionality B
CATHODE 2 Potential damage to the device depending on the location of the short. Shorts output voltage to ground, increases system current A
ANODE 3 Works fine when anode is connected to Ground but can affect application functionality otherwise C
Table 4-4 Pin FMA for Device Pins Open-Circuited on DBV Package
PIN NAME PIN NUM. DESCRIPTION OF POTENTIAL FAILURE EFFECT(S) FAILURE EFFECT CLASS
NC 1 Normal Operation D
* 2 Normal Operation D
CATHODE 3 No damage to device but can affect application functionality C
REF 4 No damage to device but can affect application functionality C
ANODE 5 No damage to device but can affect application functionality C
Table 4-5 Pin FMA for Device Pins Open-Circuited on DBZ Package
PIN NAME PIN NUM. DESCRIPTION OF POTENTIAL FAILURE EFFECT(S) FAILURE EFFECT CLASS
REF 1 No damage to device but can affect application functionality C
CATHODE 2 No damage to device but can affect application functionality C
ANODE 3 No damage to device but can affect application functionality C
Table 4-6 Pin FMA for Device Pins Short-Circuited to Adjacent Pin on DBV Package
PIN NAME PIN NUM. SHORTED TO DESCRIPTION OF POTENTIAL FAILURE EFFECT(S) FAILURE EFFECT CLASS
NC 1 * Normal Operation D
* 2 CATHODE Potential damage to the device depending on the location of the short. Shorts output voltage to ground, increases system current A
CATHODE 3 REF Works fine when used in REF to CATHODE direct feedback but can affect application functionality otherwise C
REF 4 ANODE Turns off the regulator. No damage to device but can affect application functionality B
ANODE 5 NC Normal Operation D
Table 4-7 Pin FMA for Device Pins Short-Circuited to Adjacent Pin on DBZ Package
PIN NAME PIN NUM. SHORTED TO DESCRIPTION OF POTENTIAL FAILURE EFFECT(S) FAILURE EFFECT CLASS
REF 1 CATHODE Works fine when used in REF to CATHODE direct feedback but can affect application functionality otherwise C
CATHODE 2 ANODE Potential damage to the device depending on the location of the short. Shorts output voltage to ground, increases system current B
ANODE 3 REF Turns off the regulator. No damage to device but can affect application functionality B
Table 4-8 Pin FMA for Device Pins Short-Circuited to Cathode on DBV Package
PIN NAME PIN NUM. DESCRIPTION OF POTENTIAL FAILURE EFFECT(S) FAILURE EFFECT CLASS
NC 1 Normal Operation D
* 2 Potential damage to the device depending on the location of the short. Shorts output voltage to ground, increases system current A
CATHODE 3 Normal Operation D
REF 4 Works fine when used in REF to CATHODE direct feedback but can affect application functionality otherwise C
ANODE 5 Potential damage to the device depending on the location of the short. Shorts output voltage to ground, increases system current A
Table 4-9 Pin FMA for Device Pins Short-Circuited to Cathode on DBZ Package
PIN NAME PIN NUM. DESCRIPTION OF POTENTIAL FAILURE EFFECT(S) FAILURE EFFECT CLASS
REF 1 Works fine when used in REF to CATHODE direct feedback but can affect application functionality otherwise C
CATHODE 2 Normal Operation D
ANODE 3 Potential damage to the device depending on the location of the short. Shorts output voltage to ground, increases system current A