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This document contains information for the TPSM63604 (B3QFN package) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference.
TPSM63604 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides Functional Safety Failure In Time (FIT) rates for the TPSM63604 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total Component FIT Rate | 22 |
Die FIT Rate | 4 |
Package FIT Rate | 8 |
Passives FIT Rate | 10 |
The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog / mixed signal less than 50 V supply | 25 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.
The failure mode distribution estimation for the TPSM63604 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
Die Failure Modes | Failure Mode Distribution |
---|---|
No output voltage | 60% |
Output not in specification – voltage or timing | 25% |
Gate driver stuck on | 5% |
Power Good – false trip or fails to trip | 5% |
Short circuit any two pins | 5% |
This section provides a Failure Mode Analysis (FMA) for the pins of the TPSM63604. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |
Figure 4-1 shows the TPSM63604 pin diagram. For a detailed description of the device pins, please refer to the Pin Configuration and Functions section in the TPSM63604 data sheet.
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
VIN1, VIN2 | 1, 16 | VOUT = 0 V. Possible damage to customer input supply, PCB can occur unless customer provides protection, or both. Reverse current from the VOUT pin to VIN pin, due to discharge of output capacitors, can damage the regulator. | B |
SW | 2 | Shorting the SW pin to ground will result in large currents through the device and subsequent damage. No output voltage will be produced. | A |
CBOOT | 3 | Driver supply to high-side MOSFET will be lost. Output voltage will not be regulated. Possible damage to the internal regulator and CBOOT charging circuit | B |
RBOOT | 4 | Loss of output voltage | A |
VLDOIN | 5 | Normal operation, IC powers from VIN, causing decreased efficiency. | C |
AGND | 6, 11 | No effect | D |
VCC | 7 | Internal circuits will be disabled. No output voltage will be generated. Possible increase in input current | B |
VOUT1, VOUT2 | 8, 9 | Loss of output voltage | B |
FB | 10 | The regulator will operate at maximum duty cycle. Output voltage will rise to nearly the input voltage level. Possible damage to customer load, output stage components can occur, or both. | B |
RT | 12 | Loss of output voltage | B |
PG | 13 | This is a valid connection for the PG output. PG functionality will be lost. Damage to external components connected to PG input can occur. | D |
EN/SYNC | 14 | This is a valid connection for the EN input. Enable functionality will be lost; the device will remain off with no output voltage generated. Damage to external components connected to EN input can occur. | B |
NC | 15 | No effect | D |
PGND | 17, 18, 19, 20 | This is the recommended connection for PGND. | D |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
VIN1 | 1 | VOUT normal. Current loop will be affected, potentially affecting noise/jitter/EMI/reliability. | C |
SW | 2 | Normal operation | D |
CBOOT | 3 | Normal operation | D |
RBOOT | 4 | Normal operation | D |
VLDOIN | 5 | Normal operation, IC powers from VIN, causing decreased efficiency. | C |
AGND | 6, 11 | Load regulation degraded | C |
VCC | 7 | Normal operation | D |
VOUT1 | 8 | VOUT normal. Current loop will be affected, potentially affecting noise/jitter/EMI/reliability. | C |
VOUT2 | 9 | VOUT normal. Current loop will be affected, potentially affecting noise/jitter/EMI/reliability. | C |
FB | 10 | VOUT >> than programmed output voltage. | B |
RT | 12 | Loss of output voltage | B |
PG | 13 | This is a valid connection for the PG output. PG functionality will be lost. | D |
EN/SYNC | 14 | Loss of enable functionality. Erratic operation; probable loss of regulation | B |
NC | 15 | Valid connection | D |
VIN2 | 16 | VOUT normal. Current loop will be affected, potentially affecting noise/jitter/EMI/reliability. | C |
PGND | 17, 18, 19, 20 | Load regulation degraded, thermal impedance impacted. Loss of operation if all four pins are open. | B |
Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|---|
VIN1 | 1 | SW | Damage to low-side FET | A |
SW | 2 | CBOOT | Loss of high-side gate drive supply | B |
CBOOT | 3 | RBOOT | Valid connection | D |
RBOOT | 4 | VLDOIN | Possible damage to internal circuits | A |
VLDOIN | 5 | AGND | Valid connection. Possible decrease in efficiency when VLDOIN is intended to be tied to VOUT or external bias supply | D |
AGND | 6 | VCC | Internal circuits will be disabled. No output voltage will be generated. | B |
VCC | 7 | VOUT1 | VCC ESD clamp damaged if VOUT > 5 V. | A |
VOUT1 | 8 | VOUT2 | Valid connection | D |
VOUT2 | 9 | FB | VOUT = 1 V | B |
FB | 10 | AGND | VOUT close to VIN | B |
AGND | 11 | RT | Loss of output voltage | B |
RT | 12 | PG | Possible damage to internal circuits | A |
PG | 13 | EN/SYNC | Possible damage to internal PG circuit if VEN/SYNC > 16 V | A |
EN/SYNC | 14 | NC | No effect | C |
NC | 15 | VIN2 | No effect | |
VIN2 | 16 | VIN1 | Valid connection | D |
PGND | 17, 18, 19, 20 | Any | Other pin is shorted to ground, see Table 4-5. | – |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
VIN1, VIN2 | 1, 16 | No effect (normal operation) | D |
SW | 2 | Damage to low-side FET | A |
CBOOT | 3 | VOUT = 0 V. CBOOT ESD clamp will run current to destruction. | A |
RBOOT | 4 | VOUT = 0 V. RBOOT ESD clamp will run current to destruction. | A |
VLDOIN | 5 | If VIN exceeds 16 V, damage will occur. If below, normal operation | A |
AGND | 6, 11 | VOUT = 0 V. Damage to other pins referred to GND | A |
VCC | 7 | If VIN exceeds 5.5 V, damage will occur. | A |
VOUT1, VOUT2 | 8, 9 | Damage to low-side FET. The output voltage will rise to nearly the level of VIN. Customer load will be damaged. Possible damage to device | A |
FB | 10 | If VIN exceeds 16 V, damage will occur. VOUT = 0 V | A |
RT | 12 | VOUT = 0 V | B |
PG | 13 | VOUT = 0 V. PGOOD ESD clamp will run current to destruction. | A |
EN/SYNC | 14 | Normal operation; enable functionality will be lost, the device will remain on. | D |
NC | 15 | No effect | D |
PGND | 17, 18, 19, 20 | VOUT = 0 V. Damage to low-side circuitry if VPGND >> VAGND | B |
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