SFFS408 may 2023 TLV9022-Q1 , TLV9024-Q1 , TLV9032-Q1 , TLV9034-Q1
This section provides functional safety failure in time (FIT) rates for the packages of the TLV9032-Q1 and TLV9042-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) | ||||
---|---|---|---|---|---|
Package |
SOIC-8 |
TSSOP-8 |
VSSOP-8 |
WSON-8 |
SOT23-8 |
Total component FIT rate |
9 |
8 |
6 |
4 |
4 |
Die FIT rate | 2 |
2 |
2 |
2 |
2 |
Package FIT rate |
7 |
6 |
4 |
2 |
2 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
4 | CMOS, BICMOS Digital, analog, or mixed | 12 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.