SFFS428 July   2022 ISO6763 , ISO6763-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 16-SOIC (wide-body SOIC) Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 16-QSOP (SSOP) and 16-DW (wide-body SOIC) Package

1 Overview

This document contains information for ISO6763/ISO6763-Q1 (16-DW package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the functional block diagram of one channel of ISO6763/ISO6763-Q1 for reference.

GUID-3765EC27-D1A4-4792-B6A0-9E4F6A21EFFB-low.gifFigure 1-1 Functional Block Diagram

ISO6763/ISO6763-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.