SFFS445 September   2024  – September 2024 ISO1212

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 16-DBQ (SSOP) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 16-DBQ (SSOP) Package

16-DBQ (SSOP) Package

Figure 4-1 shows the ISO1212 pin diagram for the 16-DBQ package. For a detailed description of the device pins please, see the Pin Configuration and Functions section in the ISO1212 data sheet.
ISO1212 Pin Diagram (16-DBQ
                    Package) Figure 4-1 Pin Diagram (16-DBQ Package)
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
GND1 1 Device continues to function as expected. D
VCC1 2 No power to the device on the logic side. Verify that the absolute maximum ratings for all pins of the device are met; otherwise, device damage is plausible. OUT state undetermined. A
EN 3 Disables the output buffer for OUT1 and OUT2. OUT1 and OUT2 are in a high impedance state. B
OUT1 4 OUT1 is stuck low. Device damage is plausible if IN1 and SENSE1 causes OUT1 to stay high for an extended period of time. A
OUT2 5 OUT2 is stuck low. Device damage is plausible if IN2 and SENSE2 causes OUT2 to stay high for an extended period of time. A
NC 6 Device continues to function as expected. D
7 Device continues to function as expected. D
GND1 8 Device continues to function as expected. D
FGND2 9 FGND2 is shorted to FGND2. Device continues to function as expected. D
IN2 10 IN2 is shorted to FGND2 and device damage is plausible. A
SENSE2 11 SENSE2 is shorted to FGND2 and device damage is plausible. A
SUB2 12 Substrate2 is shorted to FGND2. A negative potential in IN2 and SENSE2 pins can cause permanent damage. A
SUB1 13 Substrate1 shorted to FGND1. A negative potential in IN1 and SENSE1 pins can cause permanent damage. A
FGND1 14 FGDN1 is shorted to FGND1. Device continues to function as expected. D
IN1 15 IN1 is shorted to FGND1 and device damage is plausible. A
SENSE1 16 SENSE1 is shorted to FGND1 and device damage plausible. A
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
GND1 1 Device receives return ground through pin8. Normal operation. D
VCC1 2 Device is not powered up. If EN is high, then current can flow through ESD to VCC1 and cause damage. A
EN 3 Control on OUT1 and OUT2 output is lost but the field side data from IN and SENSE to OUT channels continues normally. B
OUT1 4 State of OUT1 is undetermined. Field side data from IN and SENSE to OUT is lost. B
OUT2 5 State of OUT2 is undetermined. Field side data from IN and SENSE to OUT is lost. B
NC 6 Device continues to function as expected. D
7 Device continues to function as expected. D
GND1 8 Device receives return ground through pin1. Normal operation. D
FGND2 9 No return ground for field side-2. B
IN2 10 No device damage but there is loss of critical functionality. B
SENSE2 11 No device damage but there is loss of critical functionality. B
SUB2 12 Substrate2 is open as expected. Normal operation. D
SUB1 13 Substrate1 is open as expected. Normal operation. D
FGND1 14 No return ground for field side-1. B
IN1 15 No device damage but there is loss of critical functionality. B
SENSE1 16 No device damage but there is loss of critical functionality. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted To Description of Potential Failure Effects Failure Effect Class
GND1 1 VCC1 No power to the device on the logic side. Verify that the absolute maximum ratings for all pins of the device are met; otherwise, device damage is plausible. A
VCC1 2 EN Externally, the VCC1 supply and EN driver output is shorted when VCC1 and EN is supplied and the logic high level and OUT is enabled and functions as expected. This function is dependent on the VCC1 and EN pin level results of the device. If VCC1 and EN is not supplied and low then OUT is not enabled and the output is off. B
EN 3 OUT1 Device damage is plausible. A
OUT1 4 OUT2 OUT1 and OUT2 might not reflect to IN1 and SENSE1 and IN2 and SENSE2, respectively. With the opposite logic state on both outputs, high current can flow between supply and ground and cause device damage. A
OUT2 5 NC Device continues to function as expected. D
NC 6 NC Device continues to function as expected. D
NC 7 GND1 Device continues to function as expected. D
GND1 8 NC Device continues to function as expected. D
FGND2 9 IN2 FGND2 shorted to IN2 and device damage is plausible. A
IN2 10 SENSE2 IN2 shorted to SENSE2 and device damage is plausible. A
SENSE2 11 SUB2 No device damage but there is loss of critical functionality. B
SUB2 12 SUB1 No device damage but there is loss of critical functionality. B
SUB1 13 FGND1 Substrate1 shorted to FGND1 and device damage is plausible. A
FGND1 14 IN1 FGND1 shorted to IN1 and device damage is plausible. A
IN1 15 SENSE1 IN1 shorted to SENSE1 and device damage is plausible. A
SENSE1 16 IN1 IN1 shorted to SENSE1 and device damage is plausible. A
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
GND1 1 Causes high current to flow in the device and device damage is plausible. A
VCC1 2 No effect. Normal operation. D
EN 3 Control to disable OUT1 and OUT2 is lost. OUT1 and OUT2 behaves as expected. B
OUT1 4 OUT1 is stuck high. Data communication from IN1 and SENSE1 to OUT1 is lost. Device damage is plausible if IN1 and SENSE1 causes OUT1 to be low. A
OUT2 5 OUT2 is stuck high. Data communication from IN2 and SENSE2 to OUT2 is lost. Device damage is plausible if IN2 and SENSE2 causes OUT2 to be low. A
NC 6 Device continues to function as expected. D
7 Device continues to function as expected. D
GND1 8 Causes high current to flow in the device and device damage is plausible. A
FGND2 9 FGND2 shorted to VCC1. Causes high current to flow in the device and device damage is plausible. A
IN2 10 IN2 is shorted to VCC1 and device damage is plausible. A
SENSE2 11 SENSE2 is shorted to VCC1 and device damage is plausible. A
SUB2 12 Substrate2 is shorted to VCC1 and device damage is plausible. A
SUB1 13 Substrate1 is shorted to VCC1 and device damage is plausible. A
FGND1 14 FGND1 is shorted to VCC1. Causes high current to flow in the device and device damage is plausible. A
IN1 15 IN1 is shorted to VCC1 and device damage is plausible. A
SENSE1 16 SENSE1 is shorted to VCC1 and device damage is plausible. A