SFFS587 February   2023 TLVM23625

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TLVM23625. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

#GUID-59B67224-3CC4-4810-AE39-411866CAB6F7 shows the TLVM23625 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TLVM23625 data sheet.

Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • The product data sheet application circuit is followed.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
RT11Switching frequency is 2.2 MHzD
PGOOD1When not in use, can be left open, grounded.D
EN/UVLO2VOUT = 0 V, part is disabledB
VIN3VOUT = 0 VB
SW5 and 6Device damage.A
BOOT7VOUT = 0, HS does not turn onB
VCC8VOUT = 0 VB
FB9VOUT = 0 VB
GND10VOUT normalD
VOUT4Goes in to hiccup, short-circuit operationB
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
RT11If its RT part, frequency is not defined. If it is a MODE/SYNC part, then part can go back and forth between FPWM/PFM. Part is up, part functional.C
PGOOD1When not in use, can be left open, grounded.D
EN/UVLO2Pin cannot be left floatingB
VIN3VOUT = 0 VB
SW5 and 6Normal operationD
BOOT7Normal operationD
VCC8VCC output is unstable, can increase above 5.5 VA
FB9VOUT = 0 V. Do not float this pin. C
GND10Vout can be abnormal, as reference voltage is not fixedC
VOUT4Normal operationB
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure EffectsFailure Effect Class
RT11PGOODIf PGOOD is high, and < 5.5V Fsw = 1 MHz; If PGOOD is low, Fsw = 2.2 MHz .PGOOD absmax being 20 V, RT ESD damages if PG goes to 20 V. A
PGOOD1EN/UVLOIf EN > 20 V, it damages devices connected to PGOOD pin.A
EN/UVLO2VINVOUT normalD
VIN3SWIf VIN > 16 V, damage occursA
SW5 and 6BOOTVOUT = 0 V, HS does not turn on, no CbootB
BOOT7VCCDamage occurs, break VCC pinA
VCC8FBCan be nonfunctional, no damage occursB
FB9GNDVOUT = 0 V (for fixed option), switches at max duty cycle for ADJ optionB
GND10RTVOUT normal if RT/MODE/SYNC pin is low, otherwise not functional.D
Vout4SWDamage occursA
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class
RT11If Vin > 5.5 V, damage occurs. If Vin < 5.5 V, switching frequency is 1 MHzA
PGOOD1If VIN > 20 V, it damages PGOODA
EN/UVLO2VOUT normalD
VIN3VOUT normalD
SW5 and 6Device damageA
BOOT7Damage occurs, BOOT ESD clamp is damagedA
VCC8If Vin > 5.5, damage occursA
FB9If VIN > 20 V, damage occursA
GND10VOUT = 0 VA
VOUT4Damage occurs if VIN > 16 VA