SFFS588 February 2023 TPS4H000-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the TPS4H000-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |
#GUID-59B67224-3CC4-4810-AE39-411866CAB6F7 shows the TPS4H000-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPS4H000-Q1 data sheet.
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
---|---|---|---|
INx | 1, 2, 3, 4 | Shutdown of corresponding channel. | B |
STx | 5, 6, 7, 8 | Version A only. Status being reported erroneous. | B |
SEH | 5 | Version B only. If DIAG_EN is high then only channel 3 or 4's (depending on SEL) sense current output on SNS pin. | B |
SEL | 6 | Version B only. If DIAG_EN is high then only channel 1 or 2's (depending on SEH) sense current output on SNS pin. | B |
FAULT | 7 | Version B only. Status being reported erroneous. | B |
CS | 8 | Version B only. Sense current not valid from CS pin. | B |
CL | 9 | Device defaults to internal current limit. | C |
GND | 10 | Resistor/diode network bypassed if present. | B |
DIAG_EN | 11 | Diagnostics disabled. | B |
THER | 12 | Device defaults to "auto-retry" mode when encountering thermal fault. | B |
NC | 13, 14 | No effect. | D |
OUTx | 15, 16, 19, 20 | Current limit of device engages. | B |
VS | 17, 18 | Device has no input supply and therefore not function. | B |
Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
---|---|---|---|
INx | 1, 2, 3, 4 | Corresponding channel shutdown and INx pulled down internally. | B |
STx | 5, 6, 7, 8 | Version A only. STx pin cannot pull high and diagnostics cannot be reported. | B |
SEH | 5 | Version B only. Pulled low internally, however wrong SNS current potentially reported on CS if DIAG_EN is high. | B |
SEL | 6 | Version B only. If DIAG_EN is high then only channel 1 or 2's (depending on SEH) sense current output on SNS pin. | B |
FAULT | 7 | Version B only. Fault signal not reported. | B |
CS | 8 | Version B only. Correct sense current cannot be read. | B |
CL | 9 | Device defaults to internal current limit. | C |
GND | 10 | Loss of ground detection engages and device shuts off. | B |
DIAG_EN | 11 | Internally pulled down. Diagnostics disabled. | B |
THER | 12 | Internally pulled down. Device defaults to "auto-retry" mode when encountering thermal fault. | B |
NC | 13, 14 | No effect. | D |
OUTx | 15, 16, 19, 20 | No effect. If configured, open load detection triggers. | B |
VS | 17, 18 | Device has no input supply and therefore not function. | B |
Pin Name | Pin No. | Shorted to | Description of Potential Failure Effects | Failure Effect Class |
---|---|---|---|---|
IN1 | 1 | IN2 | IN1 signal affects IN2 signal and vice versa. | B |
IN2 | 2 | IN3 | IN2 signal affects IN3 signal and vice versa. | B |
IN3 | 3 | IN4 | IN3 signal affects IN4 signal and vice versa. | B |
IN4 | 4 | ST1 | Version A only. If ST1 is high then channel 4 is on. | B |
IN4 | 4 | SEH | Version B only. IN4 signal affects SEH and vice versa. | B |
ST1 | 5 | ST2 | Version A only. Fault reporting of channel 1 and channel 2 erroneous. | B |
SEH | 5 | SEL | Version B only. SEH signal affects SEL and vice versa. If DIAG_EN is high only channel 1 or 4 can be read at SNS. | B |
ST2 | 6 | ST3 | Version A only. Fault reporting of channel 2 and channel 3 erroneous. | B |
SEL | 6 | FAULT | Version B only. If FAULT high and DIAG_EN high, only channel 2 or channel 4 can be read at SNS. | B |
ST3 | 7 | ST4 | Version A only. Fault reporting of channel 3 and channel 4 erroneous. | B |
FAULT | 7 | CS | Version B only. Fault reporting and current sense reporting erroneous. | B |
ST4 | 8 | CL | Version A only. ST4 voltage can cause erroneous current limit to be set on device. | B |
CS | 8 | CL | Version B only. Voltage level on CS can cause erroneous current limit to be set on device. | B |
CL | 9 | GND | Device defaults to internal current limit. | C |
DIAG_EN | 11 | THER | DIAG_EN signal affects THER signal and vice versa. | B |
THER | 12 | NC | No effect | D |
NC | 14 | OUT4 | No effect. | D |
OUT4 | 15 | OUT3 | Output of channel 4 tied to output of channel 3. | B |
OUT3 | 16 | VS | Channel 3 cannot be turned off. Short-to-battery detection triggered if configured. | B |
VS | 17 | VS | No effect. | D |
VS | 18 | OUT2 | Channel 2 cannot be turned off. Short-to-battery detection triggered if configured. | B |
OUT2 | 19 | OUT1 | Output of channel 2 tied to output of channel 1. | B |
Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
---|---|---|---|
INx | 1, 2, 3, 4 | Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
STx | 5, 6, 7, 8 | Version A only. Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
SEH | 5 | Version B only. Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell | A |
SEL | 6 | Version B only. Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
FAULT | 7 | Version B only. Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
CS | 8 | Version B only. Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
CL | 9 | Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
GND | 10 | Supply power bypassed and device does not turn on. | B |
DIAG_EN | 11 | Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
THER | 12 | Potential violation of absolute maximum rating of pin and possible breakdown of ESD cell. | A |
NC | 13, 14 | No effect. | D |
OUTx | 15, 16, 19, 20 | Output pulled to supply voltage. Short-to-battery detection triggered if configured. | B |
VS | 17, 18 | No effect. | A |