SFFS592 August 2024 LM2936Q-Q1

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the LM2936Q-Q1 (SOIC, TO-252, VSSOP, and SOT-223 packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2, Table 4-14, Table 4-14, and Table 4-14)
Pin open-circuited (see Table 4-3, Table 4-15, Table 4-15, and Table 4-15)
Pin short-circuited to an adjacent pin (see Table 4-4, Table 4-16, Table 4-16, and Table 4-16)
Pin short-circuited to IN (see Table 4-5, Table 4-17, Table 4-17, and Table 4-17)

Table 4-2 through Table 4-17 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Device contains the 3-Pin TO-252, 4-Pin SOT-223, 8-Pin SOIC, or 8-Pin VSSOP pin configurations.
Device operates at free-air temperatures between -40°C and 125°C.
Device operates at an input voltage less than 40V.
Device operates according to all recommended operating conditions and does not exceed the absolute maximum ratings.