SFFS592 August   2024 LM2936Q-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC Package
    2. 2.2 TO-252 Package
    3. 2.3 VSSOP Package
    4. 2.4 SOT-223 Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC Package
    2. 4.2 TO-252 Package
    3. 4.3 VSSOP Package
    4. 4.4 SOT-223 Package

2.1 SOIC Package

This section provides functional safety failure in time (FIT) rates for the SOIC package of the LM2936Q-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total component FIT rate18
Die FIT rate13
Package FIT rate5

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission profile: Motor control from table 11
  • Power dissipation: 500mW
  • Climate type: World-wide table 8
  • Package factor (lambda 3): Table 17b
  • Substrate material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5CMOS, BICMOS
Digital, analog, or mixed		20 FIT70°C

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.