SFFS622 april   2023 OPA333-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the OPA333-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the OPA333-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the OPA333-Q1 data sheet.

GUID-08C5AC78-90D3-465E-AA9F-859FF2910CEC-low.gifFigure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • 'Short circuit to Power or VCC' means short to V+.
  • 'Short circuit to GND or Ground' means short to V‒.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
OUT1Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT voltage ultimately forced to the GND voltage. Prolonged exposure to short-circuit conditions can result in long-term reliability issues.A
+IN3Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond due to the device in an invalid common-mode condition.C
VCC4Op-amp supplies are shorted together, leaving the VCC pin at some voltage between the VCC and GND sources (depending on the source impedance).A
‒IN5The device does not receive negative feedback. Depending on the circuit configuration, the output most likely moves to the negative supply.B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
OUT1No negative feedback or ability for OUT to drive the application.B
GND2Negative supply is left floating. The op amp ceases to function due to inability to source or sink current to the device.B
+IN3Device common-mode is disconnected. The op amp is not provided with common-mode bias, and the device output likely ends up at the positive or negative rail. The +IN pin voltage likely ends up at the positive or negative rail due to leakage on the ESD diodes.B
VCC4Positive supply is left floating. The op amp ceases to function due to inability to source or sink current to the device.A
‒IN5Inverting pin of the op amp is left floating. Negative feedback is not provided to the device, likely resulting in the device output moving between the positive and negative rails. The ‒IN pin voltage likely ends up at the positive or negative rail due to leakage on the ESD diodes.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
OUT12Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT voltage ultimately forced to the GND voltage. Prolonged exposure to short-circuit conditions can result in long-term reliability issues.A
GND23Device common-mode is tied to the negative rail. Depending on the circuit configuration, the output likely does not respond due to the device in an invalid common-mode condition.C
+IN34Depending on the circuit configuration, the application is likely not to function due to device common-mode voltage connected to +IN.B
VCC45The device does not receive negative feedback. Depending on the noninverting input voltage and circuit configuration, the output most likely moves to the negative supply.B
‒IN51Depending on the circuit configuration, the circuit gain is reduced to unity gain, and the application might not function as intended.B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
OUT1Depending on the circuit configuration, the device is likely to be forced into a short-circuit condition with the OUT voltage ultimately forced to the VCC voltage. Prolonged exposure to short-circuit conditions can result in long-term reliability issues.A
GND2Op-amp supplies are shorted together, leaving the GND pin at some voltage between the GND and VCC sources (depending on the source impedance).A
+IN3Depending on the circuit configuration, the application is likely not to function due to device common-mode voltage connected to +IN.B
‒IN5The device does not receive negative feedback. Depending on the noninverting input voltage and circuit configuration, the output most likely moves to the negative supply.B