SFFS757 February   2024 DLP4620S-Q1 , DLPC231S-Q1

 

  1.   1
  2. 1Introduction
    1.     Trademarks
  3. 2 DLP4620S-Q1 Chipset Functional Safety Capability
  4. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  5. 4 DLP4620S-Q1 Chipset Overview
    1. 4.1 Targeted Applications
    2. 4.2 DLP4620S-Q1 Chipset Functional Safety Concept
      1. 4.2.1 Typical Hazards
      2. 4.2.2 Chipset Architecture
      3. 4.2.3 Built-In Self Tests
    3. 4.3 Functional Safety Constraints and Assumptions
  6. 5Description of Hardware Component Parts
    1. 5.1 Description of System Level Built In Self Test (BISTs)
  7. 6Management of Random Faults
    1. 6.1 Fault Reporting
      1. 6.1.1 HOST_IRQ
      2. 6.1.2 Error History
      3. 6.1.3 Fault Handling
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1. 6.3.1 Video Path Protection
        1. 6.3.1.1 Video Input BISTs
        2. 6.3.1.2 Video Processing BISTs
        3. 6.3.1.3 Video Output BISTs
      2. 6.3.2 Illumination Control Protection
        1. 6.3.2.1 Communication Interface and Register Protection
        2. 6.3.2.2 LED Control Feedback Loop Protection
        3. 6.3.2.3 Data Load and Transfer Protection
        4. 6.3.2.4 Watchdogs and Clock Monitors
        5. 6.3.2.5 Voltage Monitors
  8.   A Summary of Recommended Functional Safety Mechanism Usage
  9.   B Distributed Developments
    1.     B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
    2.     B.2 Activities Performed by Texas Instruments
    3.     B.3 Information Provided
  10.   C Revision History

3.1 TI New-Product Development Process

Texas Instruments has been developing components for automotive and industrial markets since 1996. Automotive markets have strong requirements regarding quality management and product reliability. The TI new-product development process features many elements necessary to manage systematic faults. Additionally, the documentation and reports for these components can be used to assist with compliance to a wide range of standards for customer’s end applications including automotive and industrial systems (e.g., ISO 26262-4, IEC 61508-2).

This component was developed using TI’s new product development process which has been certified as compliant to ISO 9001 / IATF 16949 as assessed by Bureau Veritas (BV).

The standard development process breaks development into phases:

  • Assess
  • Plan
  • Create
  • Validate

Figure 3-1 shows the standard process.

GUID-E89CE738-F596-45DD-8D50-AB1DA8E96837-low.gifFigure 3-1 TI New-Product Development Process