SFFS757 February   2024 DLP4620S-Q1 , DLPC231S-Q1

 

  1.   1
  2. 1Introduction
    1.     Trademarks
  3. 2 DLP4620S-Q1 Chipset Functional Safety Capability
  4. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  5. 4 DLP4620S-Q1 Chipset Overview
    1. 4.1 Targeted Applications
    2. 4.2 DLP4620S-Q1 Chipset Functional Safety Concept
      1. 4.2.1 Typical Hazards
      2. 4.2.2 Chipset Architecture
      3. 4.2.3 Built-In Self Tests
    3. 4.3 Functional Safety Constraints and Assumptions
  6. 5Description of Hardware Component Parts
    1. 5.1 Description of System Level Built In Self Test (BISTs)
  7. 6Management of Random Faults
    1. 6.1 Fault Reporting
      1. 6.1.1 HOST_IRQ
      2. 6.1.2 Error History
      3. 6.1.3 Fault Handling
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1. 6.3.1 Video Path Protection
        1. 6.3.1.1 Video Input BISTs
        2. 6.3.1.2 Video Processing BISTs
        3. 6.3.1.3 Video Output BISTs
      2. 6.3.2 Illumination Control Protection
        1. 6.3.2.1 Communication Interface and Register Protection
        2. 6.3.2.2 LED Control Feedback Loop Protection
        3. 6.3.2.3 Data Load and Transfer Protection
        4. 6.3.2.4 Watchdogs and Clock Monitors
        5. 6.3.2.5 Voltage Monitors
  8.   A Summary of Recommended Functional Safety Mechanism Usage
  9.   B Distributed Developments
    1.     B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
    2.     B.2 Activities Performed by Texas Instruments
    3.     B.3 Information Provided
  10.   C Revision History

B.2 Activities Performed by Texas Instruments

The TI functional safety products are hardware components developed as functional Safety Elements out of Context. As such, TI's functional safety activities focus on those related to management of functional safety around hardware component development. System level architecture, design, and functional safety analysis are not within the scope of TI activities and are the responsibility of the customer. Some techniques for integrating the SEooC safety analysis of this hardware component into the system level can be found in ISO 26262-11.

Table 8-1 Activities Performed by Texas Instruments versus Performed by the customer
Functional Safety Lifecycle Activity(1)TI ExecutionCustomer Execution
Management of functional safetyYesYes
Definition of end equipment and itemNoYes
Hazard analysis and risk assessment (of end equipment/item)NoYes
Creation of end equipment functional safety conceptNo. Assumptions made for internal development. Yes
Allocation of end equipment requirements to sub-systems, hardware components, and software componentsNo. Assumptions made for internal development. Yes
Definition of hardware component safety requirementsYesNo
Hardware component architecture and design executionYesNo
Hardware component functional safety analysisYesNo
Hardware component verification and validation (V&V)V&V executed to support internal development. Yes
Integration of hardware component into end equipmentNoYes
Verification of IC performance in end equipmentNoYes
Selection of safety mechanisms to be applied to ICNoYes
End equipment level verification and validationNoYes
End equipment level functional safety analysisNoYes
End equipment level functional safety assessmentNoYes
End equipment release to productionNoYes
Management of functional safety issues in productionSupport provided as neededYes
(1) For component technical questions, ask our TI E2E™ support experts.