SFFS786 February   2024 TXU0204-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP-14 Package
    2. 2.2 VQFN-14 Package
    3. 2.3 TSSOP-14 and VQFN-14 Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TXU0204-Q1 (TSSOP-14 and VQFN-14 package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-6 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Figure 4-1 shows the TXU0204-Q1 pin diagram for the TSSOP-14 packages. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TXU0204-Q1 data sheet.

GUID-88A192E9-EFBC-45CC-90A8-CD667E8281FE-low.gif Figure 4-1 Pin Diagram (TSSOP-14) Package

Figure 4-2 shows the TXU0204-Q1 pin diagram for the VQFN-14 package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TXU0204-Q1 data sheet.

GUID-01F75B2B-3D06-4792-8320-2547A8B426A1-low.gif Figure 4-2 Pin Diagram (VQFN-14 Package)
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. B
A1 2 Ax will be LOW, if corresponding Bx is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Bx is LOW, then nothing will occur, no damage. B
A2 3 B
A3Y 4 B
A4Y 5 B
NC 6 Normal operation. D
GND 7 Normal operation. D
OE 8 All I/Os will be fixed into high impedance (tri-state). B
NC 9 Normal operation. D
B4 10 Bx will be LOW, if corresponding Ax is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Ax is LOW, then nothing will occur, no damage. B
B3 11 B
B2Y 12 B
B1Y 13 B
VCCB 14 Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Device will not be powered. B
A1 2 Ax input pins will be grounded internally. Ax output pins will be in HiZ if device is disabled. If device is enabled, it will be HIGH or LOW depending on the input. D
A2 3 D
A3Y 4 D
A4Y 5 D
NC 6 Normal operation. D
GND 7 Device will not be powered. B
OE 8 I/Os may be high impedance or active, unknown input state. A
NC 9 Normal operation. D
B4 10 Bx input pins will be grounded internally. Bx output pins will be in HiZ if device is disabled. If device is enabled, it will be HIGH or LOW depending on the input. D
B3 11 D
B2Y 12 D
B1Y 13 D
VCCB 14 Device will not be powered. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 A1 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. B
A1 2 A2 Two inputs shorted together will not cause damage unless there is external bus contention that drives the input such that VIL < Input Voltage < VIH in which case excessive supply current to GND may cause damage. Two outputs shorted together or an input shorted to an output may cause damage if there is external bus contention that drives one LOW while driving the other HIGH. A
A2 3 A3Y A
A3Y 4 A4Y A
A4Y 5 NC Normal operation. D
NC 6 GND Normal operation. D
GND 7 OE All I/Os will be fixed into high impedance (tri-state). B
OE 8 NC Normal operation. D
NC 9 B4 Normal operation. D
B4 10 B3 Two inputs shorted together will not cause damage unless there is external bus contention that drives the input such that VIL < Input Voltage < VIH in which case excessive supply current to GND may cause damage. Two outputs shorted together or an input shorted to an output may cause damage if there is external bus contention that drives one LOW while driving the other HIGH.

A

B3 11 B2Y A
B2Y 12 B1Y A
B1Y 13 VCCB Bx will be high, if corresponding Ax is low, there will be potential damage to the device if the current is not limited. If corresponding Ax is high, then nothing will occur, no damage. B
VCCB 14 VCCA Device will not be powered or damaged, because short is external to device System level damage may occur in this scenario. B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply VCCA
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Normal operation. D
A1 2 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. B
A2 3 B
A3Y 4 B
A4Y 5 B
NC 6 Normal operation. D
GND 7 Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. B
OE 8 All I/Os will be active, device cannot be disabled. B
NC 9 Normal operation. D
B4 10 Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. B
B3 11 B
B2Y 12 B
B1Y 13 B
VCCB 14 Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. B
Table 4-6 Pin FMA for Device Pins Short-Circuited to supply VCCB
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. B
A1 2 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. B
A2 3 B
A3Y 4 B
A4Y 5 B
NC 6 Normal operation. D
GND 7 Device will not be powered or damaged, because short is external to device. System level damage may occur in this scenario. B
OE 8 All I/Os will be active, device cannot be disabled. B
NC 9 Normal operation. D
B4 10 Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. B
B3 11 B
B2Y 12 B
B1Y 13 B
VCCB 14 Normal operation. D