SFFS787 February   2024 TXU0104-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP-14 Package
    2. 2.2 VQFN-14 Package
    3. 2.3 TSSOP-14 and VQFN-14 Packages
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TSSOP-14 and VQFN-14 Package

4.1 TSSOP-14 and VQFN-14 Package

Figure 4-1 shows the TXU0104-Q1 pin diagram for the TSSOP-14 package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TXU0104-Q1 data sheet.

GUID-74F454E1-8ED4-4F72-BBB5-06990C092B7E-low.gif Figure 4-1 Pin Diagram (TSSOP-14) Package

Figure 4-2 shows the TXU0104-Q1 pin diagram for the VQFN-14 package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TXU0104-Q1 data sheet.

GUID-B217ADA8-EC25-4306-A882-F97DF102E2AB-low.gif Figure 4-2 Pin Diagram (VQFN-14 Package)
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Device will not be powered or damaged, because short is external to device. System level damage can occur in this scenario. B
A1 2 Ax will be LOW, if corresponding Bx is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Bx is LOW, then nothing will occur, no damage. B
A2 3 B
A3 4 B
A4 5 B
NC 6 Normal operation. D
GND 7 Normal operation. D
OE 8 All I/Os will be fixed into high impedance (tri-state). B
NC 9 Normal operation. D
B4Y 10 Bx will be LOW, if corresponding Ax is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Ax is LOW, then nothing will occur, no damage. B
B3Y 11 B
B2Y 12 B
B1Y 13 B
VCCB 14 Device will not be powered or damaged, because the short is external to device. System level damage can occur in this scenario. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Device will not be powered. B
A1 2 Ax pin will be grounded internally. D
A2 3 D
A3 4 D
A4 5 D
NC 6 Normal operation. D
GND 7 Device will not be powered. B
OE 8 I/Os can be high impedance or active, unknown input state. A
NC 9 Normal operation. D
B4Y 10 Bx pin will be in HiZ if device is disabled. If device is enabled, it will be HIGH or LOW depending upon the input. D
B3Y 11 D
B2Y 12 D
B1Y 13 D
VCCB 14 Device will not be powered. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 A1 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. B
A1 2 A2 Two inputs shorted together will not cause damage unless there is external bus contention that drives the input such that VIL < Input Voltage < VIH in which case excessive supply current to GND can cause damage. B
A2 3 A3 B
A3 4 A4 B
A4 5 NC Normal operation. D
NC 6 GND Normal operation. D
GND 7 OE All I/Os will be fixed into high impedance (tri-state). B
OE 8 NC Normal operation. D
NC 9 B4Y Normal operation. D
B4Y 10 B3Y Two outputs shorted together can cause damage if there is external bus contention that drives one output LOW while driving the other output HIGH. A
B3Y 11 B2Y A
B2Y 12 B1Y A
B1Y 13 VCCB Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. B
VCCB 14 VCCA Device will not be powered or damaged, because short is external to device System level damage can occur in this scenario. B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply VCCA
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Normal operation. D
A1 2 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. B
A2 3 B
A3 4 B
A4 5 B
NC 6 Normal operation. D
GND 7 Device will not be powered or damaged, because short is external to device. System level damage can occur in this scenario. B
OE 8 All I/Os will be active, device cannot be disabled. B
NC 9 Normal operation. D
B4Y 10 Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. B
B3Y 11 B
B2Y 12 B
B1Y 13 B
VCCB 14 Device will not be powered or damaged, because short is external to device. System level damage can occur in this scenario. B
Table 4-6 Pin FMA for Device Pins Short-Circuited to supply VCCB
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Device will not be powered or damaged, because short is external to device. System level damage can occur in this scenario. B
A1 2 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. B
A2 3 B
A3 4 B
A4 5 B
NC 6 Normal operation. D
GND 7 Device will not be powered or damaged, because short is external to device. System level damage can occur in this scenario. B
OE 8 All I/Os will be active, device cannot be disabled. B
NC 9 Normal operation. D
B4 10 Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. B
B3 11 B
B2 12 B
B1 13 B
VCCB 14 Normal operation. D