SFFS789 February   2024 TXV0106-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TXV0106-Q1 (WQFN package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-6 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Figure 4-1 shows the TXV0106-Q1 pin diagram for the WQFN package. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TXV0106-Q1 data sheet.

GUID-20230621-SS0I-XWP2-PQN1-9MQLFDG6MQKF-low.svg Figure 4-1 Pin Diagram (WQFN) Package
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 GND short to VCC, device will be bypassed . This may cause system damage, but not device damage B
A1 - A6 2 to 7 Ax will be LOW, if corresponding Bx is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Bx is LOW, then nothing will occur, no damage. B
GND 8 Normal operation. D
OE (active low) 9 Outputs will remain enabled B
B6 - B1 10 to 15 Bx will be LOW, if corresponding Ax is HIGH, there will be potential damage to the device if the current is not limited. If corresponding Ax is LOW, then nothing will occur, no damage. B
VCCB 16 GND short to VCC, device will be bypassed - may cause system damage, but not device damage B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Device will not be powered. B
A1 - A6 2 to 7 Ax input pins will be floating, there will be potential damage to the device if the current is not limited. A
GND 8 Device will not be powered. B
OE (active low) 9 OE input pin will be floating, there will be potential damage to the device causing outputs to switch between enabled and disabled, if the current is not limited. B
B6 - B1 10 to 15 Bx output pins will be in HiZ if device is disabled. If device is enabled, it will be HIGH or LOW depending on the input. D
VCCB 16 Device will not be powered. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 A1 A1 will be HIGH, if corresponding B1 is LOW, there will be potential damage to the device if the current is not limited. If corresponding B1 is HIGH, then nothing will occur, no damage. B
A(n) 2 to 6 A(n+1) Two inputs shorted together will not cause damage unless there is external bus contention that drives the input such that VIL < Input Voltage < VIH in which case excessive supply current to GND may cause damage. B
A6 7 GND A6 will be LOW, if corresponding B6 is HIGH, there will be potential damage to the device if the current is not limited. If corresponding B6 is LOW, then nothing will occur, no damage. B
GND 8 OE (active low) Outputs will remain enabled. B
OE (active low) 9 B6 If B6 is HIGH, OE will be LOW and the outputs will remain enabled. If corresponding B6 is LOW, then outputs will be disabled. B
B(n) 10 to 15 B(n+1) Two outputs shorted together may cause damage if there is external bus contention that drives one LOW while driving the other HIGH. D
B1 15 VCCB B1 will be HIGH, if corresponding A1 is LOW, there will be potential damage to the device if the current is not limited. If corresponding A1 is HIGH, then nothing will occur, no damage. B
VCCB 16 VCCA GND short to VCC, device will be bypassed . This may cause system damage, but not device damage. B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply VCCA
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 Normal operation. D
A1 - A6 2 to 7 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur, no damage. B
GND 8 GND short to VCC, device will be bypassed. This may cause system damage, but not device damage. B
OE (active low) 9 Outputs will remain disabled. B
B6 - B1 10 to 15 Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. B
VCCB 16 VCCB short to VCCA, device will be bypassed. This may cause system damage, but not device damage. B
Table 4-6 Pin FMA for Device Pins Short-Circuited to supply VCCB
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VCCA 1 VCCB short to VCCA, device will be bypassed . This may cause system damage, but not device damage B
A1 - A6 2 to 7 Ax will be HIGH, if corresponding Bx is LOW, there will be potential damage to the device if the current is not limited. If corresponding Bx is HIGH, then nothing will occur; no damage. B
GND 8 GND short to VCC, device will be bypassed. This may cause system damage, but not damage to the device. B
OE (active low) 9 Outputs will remain disabled. B
B6 - B1 10 to 15 Bx will be HIGH, if corresponding Ax is LOW, there will be potential damage to the device if the current is not limited. If corresponding Ax is HIGH, then nothing will occur, no damage. B
VCCB 16 Normal operation. D