SFFS819 May 2024 RES11A-Q1
This section provides functional safety failure in time (FIT) rates for the SOT-23-THIN package of the RES11A50-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) | ||||
---|---|---|---|---|---|
100% of Rated Power | 80% | 60% | 40% | 20% | |
Total component FIT rate | 8 | 7 | 6 | 6 | 5 |
Die FIT rate | 6 | 5 | 4 | 4 | 3 |
Package FIT rate | 2 | 2 | 2 | 2 | 2 |
The failure rate and mission profile information in Table 2-19 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS, BICMOS Digital, analog, or mixed |
20 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-20 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.