SFFS820 May   2024 SN74AXC4T245-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 WQFN Package
    3. 2.3 UQFN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TSSOP Package
    2. 4.2 WQFN Package
    3. 4.3 UQFN Package

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the SN74AXC4T245-Q1 (TSSOP, WQFN and UQFN packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-6 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1 .

Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality
B No device damage, but loss of functionality
C No device damage, but performance degradation
D No device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • External pullup resistor on CS to VDD
  • RC filter on every analog input, AINx. Series resistors are sized to limit the input currents into the analog inputs to < 10mA in all circumstances (for example, in case the device is unpowered and the input signal is applied).
  • The device is the only slave on the SPI bus.