SFFS832 September 2024 UCC27301A-Q1 , UCC27311A-Q1
This section provides functional safety failure in time (FIT) rates for the VSON package of the UCC273x1A-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
---|---|
Total component FIT rate | 7 |
9 | |
Die FIT rate | 3 |
5 | |
Package FIT rate | 4 |
4 |
The failure rate and mission profile information in Table 2-3 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
FIT IEC TR 62380 / ISO 26262 | Power Dissipation (mW) | FIT (Failures Per 109 Hours) |
---|---|---|
Total component FIT rate | 10 | 7 |
400 | 9 | |
Die FIT rate | 10 | 3 |
400 | 5 | |
Package FIT rate | 10 | 4 |
400 | 4 |
The failure rate and mission profile information in Table 2-4 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog, or mixed |
20 FIT | 55°C |
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog, or mixed |
20 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-5 and Table 2-6 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.