SFFS925 July   2024 TMUX1308A , TMUX1308A-Q1 , TMUX1309A , TMUX1309A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TMUX1308A-Q1 TSSOP Package
    2. 4.2 TMUX1309A-Q1 TSSOP Package

1 Overview

This document contains information for the TMUX1308A-Q1 and TMUX1309A-Q1 (TSSOP package) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

TMUX1308A TMUX1309A Functional Block DiagramFigure 1-1 Functional Block Diagram

The TMUX1308A-Q1 and TMUX1309A-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.