TCAN1472-Q1 and TCAN1472V-Q1
Functional Safety FIT Rate, FMD, and Pin FMA

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1 Overview

This document contains information for TCAN1472-Q1 and TCAN1472V-Q1 to aid in a functional safety system design. These devices are controller area network (CAN) signal improvement capable (SIC) transceivers compliant to CiA 601-4 and are available in the SOIC (D), VSON (DRB), and SOT (DDF) packages. Information provided are:

Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
Component failure modes and their distribution (FMD) based on the primary function of the device
Pin failure mode analysis (pin FMA) for the device pins of TCAN1472-Q1 and TCAN1472V-Q1

Figure 1-1 shows the device functional block diagram for reference. TCAN1472V-Q1 has the V_IO input at pin 5, while TCAN1472-Q1 has a no connect (NC) at pin 5.

TCAN1472-Q1 TCAN1472V-Q1 TCAN1472-Q1 and
TCAN1472V-Q1 Functional Block Diagram

Figure 1-1 TCAN1472-Q1 and TCAN1472V-Q1 Functional Block Diagram

TCAN1472-Q1 and TCAN1472V-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

This section provides functional safety failure in time (FIT) rates for TCAN1472-Q1 and TCAN1472V-Q1 based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 and ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours) 8-pin SOIC (D)	FIT (Failures Per 10⁹ Hours) 8-pin VSON (DRB)	FIT (Failures Per 10⁹ Hours) 8-pin SOT (DDF)
Total component FIT rate	10	7	5
Die FIT rate	3	3	3
Package FIT rate	7	4	2

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission profile: Motor control from table 11
Power dissipation: 132mW
Climate type: World-wide table 8
Package factor (lambda 3): Table 17b
Substrate material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS/BICMOS ASICs Analog and Mixed = <50V supply	25 FIT	55°C

The reference FIT rate and reference virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.