SFFSA42 December 2024 UCC33020-Q1 , UCC33420 , UCC33420-Q1
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This document contains information for the UCC33420, UCC33420-Q1, UCC33020, and UCC33020-Q1 (VSON-12 package) to aid in a functional safety system design. Information provided are:
Figure 1-1 shows the device functional block diagram for reference.
The UCC33420, UCC33420-Q1, UCC33020, and UCC33020-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.
This section provides functional safety failure in time (FIT) rates for the VSON-12 package of UCC33420, UCC33420-Q1, UCC33020, and UCC33020-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | Power Dissipation | FIT (Failures Per 109 Hours) |
---|---|---|
Total component FIT rate | 0.5W | 13 |
1W | 18 | |
1.23W | 20 | |
Die FIT rate | 0.5W | 4 |
1W | 8 | |
1.23W | 10 | |
Package FIT rate | 0.5W | 9 |
1W | 10 | |
1.23W | 10 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
5 | CMOS,
BICMOS Digital, analog, or mixed | 60 FIT | 70°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.